Gas Flow Accelerator With Rotational Flow for Pump Line Buildup
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Solution Overview
Problem
The buildup of processing byproducts in the vacuum chuck and plumbing fixtures of semiconductor processing tools reduces the effectiveness of the vacuum chuck, leading to decreased productivity due to frequent maintenance needs.
Innovation Solution
A gas flow accelerator with a cylindrical body and tapered cylindrical body portion is used to generate a rotational flow of process gas, preventing buildup on the interior walls of the main pumping line by orienting the chuck vacuum line parallel to the main pumping line and incorporating an outlet port and pressure relief port to maintain airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the main pumping line is used to remove process gas from the process chamber, then the process gas is effectively removed, but processing byproducts build up on the interior walls of the pumping line
Solution Approach 1:
The patent introduces a second pumping line that runs parallel to the first pumping line, creating a dual-line configuration. This dimensional addition allows the system to maintain gas removal functionality while providing a separate pathway that prevents byproduct accumulation on the interior walls, thereby resolving the contradiction between effective gas removal and byproduct buildup prevention
2Reliability
If the vacuum chuck is cleaned frequently to remove processing byproducts, then the vacuum chuck effectiveness is maintained, but tool downtime increases
Solution Approach 1:
The patent implements a preventive design by incorporating a second pumping line from the beginning that prevents byproduct buildup before it occurs. This preliminary structural action eliminates the need for frequent maintenance cleaning, thereby maintaining vacuum chuck effectiveness while avoiding the productivity loss associated with tool downtime
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents or reduces the buildup of processing byproducts, maintaining the effectiveness of the vacuum chuck and reducing the frequency of tool downtime for maintenance, thereby increasing productivity.
Implementation Method 1
The tapered cylindrical body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line
Data Source
AI summary
A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.