Gas Flow Accelerator With Rotational Flow for Clean Pumping Lines
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Solution Overview
Problem
The buildup of processing byproducts in the main pumping line of semiconductor processing tools reduces the effectiveness of vacuum chucks, necessitating frequent maintenance and decreasing productivity.
Innovation Solution
A gas flow accelerator with a cylindrical body and tapered portion is used to generate a rotational flow of process gas, maintaining parallel orientation with the chuck vacuum line to prevent byproduct buildup on the main pumping line walls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If process gas flows through the main pumping line, then the vacuum chuck can retain the semiconductor device, but processing byproducts build up on the interior walls of the main pumping line
Solution Approach 1:
The patent employs curved or angled interior surfaces in the main pumping line instead of straight parallel walls. This curvature causes the process gas to follow a rotational or spiral path through the pumping line, preventing byproducts from settling on the walls and eliminating the need for frequent maintenance while maintaining vacuum chuck effectiveness.
2Productivity
If the main pumping line is used to remove process gas, then gas removal is achieved, but the line becomes clogged with processing byproducts requiring frequent maintenance
Solution Approach 1:
By designing the main pumping line with curved interior surfaces that create rotational gas flow, the system maintains continuous productivity without interruptions. The rotational flow pattern prevents byproduct deposition on walls, eliminating clogging issues and reducing maintenance frequency while preserving gas removal efficiency.
3Quantity of substance
If processing byproducts accumulate on the main pumping line walls, then the line capacity is reduced, but frequent maintenance is required to restore capacity
Solution Approach 1:
The curved interior geometry of the main pumping line creates a self-cleaning effect through rotational gas flow. This design prevents byproduct accumulation that would reduce line capacity, maintaining full operational capacity over extended periods and significantly reducing maintenance frequency and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents clogging of the main pumping line, enhancing the effectiveness of vacuum chucks and reducing maintenance frequency, thereby increasing the productivity of semiconductor processing tools.
Implementation Method 1
The tapered cylindrical body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line
Data Source
AI summary
A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.