Gas Supply Flow Modifier for Uniform Semiconductor Gas Distribution
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Solution Overview
Problem
Existing gas supply systems struggle to evenly distribute processing gas across substrates, especially at increased flow rates, leading to uneven film formation during semiconductor manufacturing.
Innovation Solution
A gas supply system with a flow path and multiple openings intersecting the path, incorporating a flow modifier to perturb the gas flow, ensuring uniform distribution across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the flow rate of processing gas is increased to meet refinement requirements, then the gas supply capacity is improved, but the uniformity of gas distribution between substrates deteriorates
Solution Approach 1:
The flow path is divided into multiple independent channels, each serving specific openings. This segmentation allows different flow rates to be controlled for different groups of openings, enabling high overall flow rate while maintaining uniform distribution through balanced channel design
Solution Approach 2:
Different portions of the flow path are designed with different characteristics (e.g., different channel lengths, cross-sectional areas, or flow modifiers) to optimize gas distribution locally. This ensures that each region delivers appropriate flow rates to achieve uniform gas distribution across all substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves even gas distribution, improving film thickness uniformity and consistency across substrates, enhancing semiconductor manufacturing quality.
Implementation Method 1
a flow modifier provided to block a portion of the flow path, and configured to perturb flow of the gas flowing in the flow path toward the plurality of openings
Data Source
AI summary
A gas supply includes: a flow path in which a gas flows; a plurality of openings respectively provided in a direction intersecting the flow path to supply the gas into a processing chamber, and a flow modifier provided to block a portion of the flow path, and configured to perturb flow of the gas flowing in the flow path toward the plurality of openings.