Gas Flow Velocity Control for Sublimable Material Layer Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the manufacturing of electronic devices, such as semiconductor devices, achieving an appropriate thickness of a layer containing a sublimable material while maintaining productivity is challenging, especially when using a batch processing method, as it can result in unevenness or prolonged removal times.
Innovation Solution
A processing apparatus with a gas supply section that controls the thickness of the sublimable material layer by adjusting the flow velocity of gas on the workpiece surfaces, allowing for precise control of the layer thickness and improving productivity through a combination of fluid and gas supply processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single-wafer spin method is used to apply the solution containing the sublimable material, then the thickness of the layer containing the sublimable material can be appropriately controlled, but productivity is low
Solution Approach 1:
The batch processing method is segmented into multiple sequential steps: applying first fluid to multiple workpieces, then applying the sublimable material solution, and finally controlling evaporation. This segmentation allows batch processing while maintaining thickness control through the evaporation control step.
Solution Approach 2:
The patent controls the thickness of the sublimable material layer by changing parameters during the evaporation process, including temperature, humidity, and air flow velocity. By adjusting these parameters, uniform thickness control is achieved in batch processing mode, resolving the contradiction between productivity and precision.
2Productivity
If a batch processing method is used to immerse multiple workpieces, then productivity is improved, but it is difficult to appropriately control the thickness of the layer containing the sublimable material
Solution Approach 1:
The patent maintains continuous control over the evaporation process for all workpieces in the batch. By controlling the evaporation of the solvent continuously and uniformly across all workpieces through regulated temperature and air flow, the useful action of forming a uniform layer is maintained throughout the batch processing cycle.
Solution Approach 2:
The system incorporates feedback control by monitoring the evaporation process and adjusting parameters such as air flow velocity and temperature to maintain consistent layer thickness across all workpieces. This feedback mechanism ensures that thickness precision is maintained even when processing multiple workpieces simultaneously.
3Reliability
If the sublimable material layer is made thicker to prevent collapse of irregular patterns, then pattern stability is improved, but processing time is prolonged
Solution Approach 1:
The patent utilizes the phase transition of the sublimable material from solid to gas directly (sublimation) for removal. By selecting a material with appropriate sublimation characteristics and controlling the sublimation process parameters, the material can form a sufficiently thick protective layer that stabilizes patterns while being removed efficiently through controlled sublimation, minimizing processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of a sublimable material layer with an appropriate thickness, balancing between preventing collapse of irregular patterns and enhancing processing efficiency by controlling the gas flow velocity, thus addressing the limitations of both single-wafer spin and batch processing methods.
Implementation Method 1
the gas supply section controls a thickness of the layer containing the sublimable material formed each surface of the plurality of workpieces by controlling a flow velocity of the gas in each surface of the plurality of workpieces
Implementation Method 2
the sublimation section that sublimates a layer containing the sublimable material formed on each surface of the plurality of workpieces
Data Source
AI summary
According to one embodiment, a processing apparatus includes a first supply section, a second supply section, a gas supply section, and a sublimation section. The first supply section supplies a first fluid on surfaces of a plurality of workpieces. The second supply section supplies a fluid containing a sublimable material on the surfaces of the plurality of workpieces to which the first fluid is supplied. The gas supply section supplies gas on the surfaces of the plurality of workpieces to which a fluid containing the sublimable material is supplied. The sublimation section sublimates a layer containing the sublimable material formed on each surface of the plurality of workpieces. The gas supply section controls a thickness of the layer containing the sublimable material formed each surface of the plurality of workpieces by controlling a flow velocity of the gas in each surface of the plurality of workpieces.