Gas Injection Apparatus Radial Trenches Minimize Source Gas Intermixing

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Solution Overview

Problem

In thin film deposition processes, particularly in semiconductor manufacturing, the intermixing of source gases in vacuum containers leads to prolonged purging cycles and reduced throughput, necessitating a solution to minimize the intermixing area of source gases and purge gases.

Innovation Solution

A gas injection apparatus with a base plate featuring fan-shaped gas supply regions and trenches, where the sidewalls of these regions face each other radially, and jet holes are strategically positioned to minimize intermixing by controlling gas flow and pressure, allowing for simultaneous supply of source gases and purge gases without interreaction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If source gases are supplied simultaneously in a vacuum container, then gas reaction area is increased, but intermixing of source gases occurs leading to prolonged purging cycles

Engineering Contradiction:
ImprovethroughputVSAvoidpurging cycle time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The gas supply system is segmented into multiple independent gas supply regions separated by trenches. Each region supplies a specific source gas independently, preventing intermixing while maintaining simultaneous supply capability. The trenches act as physical barriers that divide the gas flow paths, allowing each gas to reach its designated reaction zone without contaminating other zones.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the gas supply plate are assigned different functions with localized gas supply characteristics. Each gas supply region has optimized jet hole patterns and flow rates tailored to specific deposition requirements. The trenches create localized containment zones where each gas maintains its purity while contributing to the overall deposition process.

Inventive Principle:
Principle #3Local quality

2Reliability

If purge gas is used extensively to prevent intermixing, then source gas contamination is reduced, but deposition time is prolonged

Engineering Contradiction:
Improvegas purityVSAvoiddeposition throughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The harmful element (purge gas) is extracted from the deposition process by replacing it with physical barriers (trenches) that prevent gas intermixing without requiring extensive purging. The trenches eliminate the need for purge gas in many cases, as the physical separation maintains gas purity inherently, thereby reducing cycle time while maintaining reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The trenches serve as intermediary structures that mediate between different gas supply regions. Instead of using purge gas as a mediator to prevent intermixing, the trenches provide a permanent physical mediation that continuously prevents gas contact, eliminating the need for time-consuming purging operations while maintaining gas purity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If multiple gas nozzles are arranged closely to increase reaction area, then gas utilization efficiency is improved, but gas intermixing increases

Engineering Contradiction:
Improvegas reaction areaVSAvoidgas intermixing
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The trenches are nested within the gas supply plate structure, creating a multi-level configuration where gas supply regions are embedded in a plate with integrated separation structures. This nesting allows maximum gas reaction area within the available space while the trenches provide inherent separation, preventing intermixing despite the close arrangement of multiple gas nozzles.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances gas reaction area efficiency, reduces intermixing, and increases throughput by optimizing gas flow and pressure distribution, enabling precise control over thin film deposition processes.

Implementation Method 1

jet holes are strategically positioned to minimize intermixing by controlling gas flow and pressure

Methodology Applied
Scientific EffectGas flow control:

Data Source

PatentUS10669631B2Gas injection apparatus and thin film deposition equipment including the same
Publication Date: 2020.06.02 SAMSUNG ELECTRONICS CO LTD
  • US10669631B2 patent drawing
  • US10669631B2 patent drawing
  • US10669631B2 patent drawing

AI summary

A gas injection apparatus, which can sequentially supply a substrate with at least two kinds of source gases reacting with each other in a container, and thin film deposition equipment including the gas injection apparatus, are provided. The gas injection apparatus includes a base plate, a first gas supply region protruding from the base plate, a second gas supply region protruding from the base plate and adjacent the first gas supply region, and a trench defined by a sidewall of the first gas supply region and a sidewall of the second gas supply region. The sidewall of the first gas supply region and the sidewall of the second gas supply region face each other and extend in a radial direction on the base plate.