Gas Injection Assembly for Sputtering Substrate Transfer
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Solution Overview
Problem
Existing sputtering devices cause back scratches and damage to fragile glass substrates due to direct contact and unstable air streams during loading and unloading, especially when transitioning between vacuum and atmospheric states.
Innovation Solution
A sputtering device with a gas injection assembly that forms a gas cushion between the substrate and the substrate transferring unit, preventing direct contact and stabilizing the substrate transfer by controlling the gas flow to maintain a consistent gap, thereby reducing the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is directly contacted with the supporter for stable transfer, then the substrate position is stabilized, but the substrate surface is scratched or damaged
Solution Approach 1:
A gas cushion is introduced as an intermediary between the substrate and the supporter to enable non-contact transfer. The gas flows through gaps in the supporter to create a stable floating layer that prevents direct contact while maintaining position stability during loading, unloading, and film deposition operations.
2Ease of operation
If the substrate is transferred horizontally through vacuum and atmospheric regions, then the substrate can be loaded and unloaded, but unstable air streams cause substrate movement and damage
Solution Approach 1:
The gas cushion acts as a mediator that stabilizes the substrate during transitions between vacuum and atmospheric regions. The continuous gas flow compensates for unstable air streams encountered during horizontal transfer through different pressure zones, preventing substrate movement and damage while enabling easy loading and unloading operations.
3Strength
If the substrate is fixed to the supporter, then the substrate is securely held, but back scratches occur on the substrate surface
Solution Approach 1:
The gas cushion serves as a mediator between the substrate back surface and the supporter, eliminating direct contact that causes scratching. The gas flow through the supporter gaps provides sufficient holding security during transfer operations while preventing mechanical damage to the substrate surface, thus maintaining both holding strength and surface integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The gas cushion effectively prevents back scratches and damage to the substrate by stabilizing its position during transfer and film deposition, ensuring reliable handling and minimizing substrate degradation.
Implementation Method 1
a gas injection assembly forming a gas cushion between the substrate and an upper surface of the substrate transferring unit
Implementation Method 2
a specific pressure and a voltage are supplied to an inactive gas inside the vacuum chamber, to generate a plasma around a target
Implementation Method 3
Positive ions in the plasma formed around the target hit a surface of the target with an electric force
Implementation Method 4
a magnet 25 for generating a magnetic field at rear surfaces of the target 21 and the cathode plate 23
Implementation Method 5
a vacuum pump 30 for maintaining a vacuum state inside the vacuum chamber 10
Implementation Method 6
When the transferred kinetic energy is greater than a bonded energy between the hit atoms, the atoms on the surface of the target are emitted from the target to be deposited onto the substrate
Data Source
AI summary
A sputtering device includes a chamber; and a substrate transferring unit for loading a substrate into, or unloading the substrate from the chamber, the substrate transferring unit including a gas injection assembly forming a gas cushion between the substrate and an upper surface of the substrate transferring unit.