Gas-Levitation Substrate Conveyance for Uniform Laser Irradiation
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Solution Overview
Problem
Existing conveyance systems for laser irradiation processes, such as those used in semiconductor manufacturing, face challenges in achieving high-speed and stable substrate conveyance to ensure uniform laser irradiation across the substrate surface.
Innovation Solution
A conveyance apparatus featuring a main levitation unit, holding mechanisms, and moving mechanisms that allow for precise movement and levitation of the substrate, including a movable levitation unit and a conveyance unit, which includes a movable levitation mechanism and a movable levitation unit, allows for precise control of substrate positioning and movement of the substrate, enabling gas ejection and suction mechanisms, and a movable levitation unit, to adjust the substrate's position and orientation for uniform laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional conveyance system is used to convey the substrate, then the substrate can be moved through the laser irradiation area, but the conveyance speed and stability are insufficient to achieve high-speed and uniform laser irradiation across the entire substrate surface
Solution Approach 1:
The patent replaces conventional mechanical contact-based conveyance systems with a gas levitation system. The substrate is levitated above the conveyance surface using gas pressure, eliminating mechanical friction and contact points that limit speed and cause instability. This allows the substrate to be conveyed at higher speeds while maintaining stable positioning for uniform laser irradiation.
2Productivity
If the substrate is conveyed quickly through the laser irradiation area, then productivity increases, but the uniformity and quality of laser irradiation deteriorates
Solution Approach 1:
By replacing mechanical conveyance with gas levitation, the system achieves both high speed and high precision. The gas cushion provides smooth, vibration-free movement while the levitated position ensures consistent distance between the substrate and laser source, maintaining irradiation uniformity even at high conveyance speeds.
Solution Approach 2:
The system dynamically adjusts the gas pressure to maintain optimal levitation height during high-speed conveyance. This dynamic control ensures that the substrate remains at the correct distance from the laser irradiation area throughout the process, preserving irradiation uniformity while enabling high-speed operation.
3Measurement precision
If mechanical contact is used to hold and move the substrate, then the substrate can be positioned, but substrate bending occurs which affects laser irradiation quality
Solution Approach 1:
The patent eliminates mechanical contact between the conveyance system and the substrate by using gas levitation. This substitution prevents mechanical forces that cause substrate bending while still providing accurate positioning through controlled gas pressure distribution, maintaining both positioning accuracy and substrate flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed and stable conveyance of substrates for uniform laser irradiation, reducing substrate bending and improving the quality of semiconductor manufacturing processes by ensuring consistent crystallization of amorphous films into polycrystalline films.
Implementation Method 1
a main levitation unit (10) configured to levitate the substrate (100) over a top surface (10t) of itself
Implementation Method 2
irradiate the substrate with line-shaped laser light
Implementation Method 3
an amorphous silicon film is crystallized and becomes a polysilicon film
Implementation Method 4
configured to eject gas onto a bottom surface (100b) of the substrate (100)
Data Source
AI summary
A conveyance apparatus (600) according to an embodiment is configured to convey a substrate (100) in order to irradiate the substrate (100) with line-shaped laser light (15), and includes: a main levitation unit (10) including an irradiation area disposed directly below an irradiation place of the laser light, and configured to levitate the substrate over a top surface thereof; a holding mechanism (11) disposed outside the main levitation unit (10) and configured to hold the substrate (100) over the main levitation unit; a first moving mechanism configured to move the holding mechanism (11) in a first direction in order to change the irradiation place of the laser light over the substrate (100); and a second moving mechanism configured to move the holding mechanism and the first moving mechanism in a second direction inclined from the first direction.