Gas-Liquid Mixing Conduit for Substrate Processing
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Solution Overview
Problem
The increasing demand for high-reliability and high-performance electronic devices is hindered by the high manufacturing costs of substrate processing, necessitating a cost-effective solution for substrate processing apparatus and methods.
Innovation Solution
A substrate processing apparatus that includes a conduit system for mixing a processing solution with gas, which is injected onto the substrate at elevated pressure, allowing for efficient cutting and cleaning while reducing the consumption of processing solution and abrasive materials through the use of a head unit with internal space and transferring units for precise movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a conventional substrate processing apparatus is used, then substrate cutting and cleaning can be performed, but the manufacturing cost is high due to excessive consumption of processing solution and abrasive materials
Solution Approach 1:
The patent applies pneumatic principles by introducing gas (air) into the processing solution through a conduit system. The gas flows through the processing solution in the conduit, creating a气液混合流 (gas-liquid mixture) that is then injected onto the substrate. This pneumatic enhancement improves the cutting and cleaning effectiveness while reducing the quantity of processing solution and abrasive materials needed, thereby resolving the contradiction between substance consumption and processing effectiveness.
2Manufacturing precision
If processing solution is supplied at ambient pressure, then the system is simple, but the injection effectiveness onto the substrate is insufficient for efficient cutting and cleaning
Solution Approach 1:
The patent employs pneumatic-hydraulic integration by combining gas flow through the processing solution in the conduit with pressurized injection onto the substrate. The conduit system is designed to allow gas to mix with the processing solution before injection, creating a pressurized gas-liquid mixture that enhances cutting and cleaning effectiveness. This approach achieves improved manufacturing precision while maintaining relatively simple device complexity through the integrated conduit design.
3Manufacturing precision
If high pressure is applied to the processing solution, then injection effectiveness improves, but the system complexity and energy consumption increase
Solution Approach 1:
The patent utilizes pneumatic energy efficiency by introducing gas into the processing solution conduit system. The gas flow contributes to pressurizing the processing solution as it moves through the conduit, reducing the need for high-energy mechanical pressurization systems. The gas-liquid mixture is injected onto the substrate with sufficient pressure for effective cutting and cleaning, while the overall energy consumption is reduced compared to purely hydraulic pressurization systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective cutting and cleaning of substrates with reduced processing solution consumption, thereby lowering operational costs and enhancing the efficiency of substrate processing.
Implementation Method 1
a second conduit in fluid communication with the first conduit, the second conduit configured to supply a gas to the first conduit to be mixed with the processing solution
Implementation Method 2
a processing solution supplying portion in fluid communication with the first conduit and configured to supply the processing solution at a pressure higher than ambient pressure
Data Source
AI summary
Provided is a substrate processing apparatus including a first conduit configured to supply a processing solution to a substrate loaded on a supporter, and a second conduit in fluid communication with the first conduit, the second conduit configured to supply a gas to the first conduit to be mixed with the processing solution, wherein the first conduit includes an opening to permit the processing solution mixed with the gas to be injected onto the substrate.