Gas-Liquid Two-Phase Atomizing Cleaning Device for Semiconductor Wafer
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Solution Overview
Problem
Conventional cleaning technologies for semiconductor wafers face inefficiencies due to poor transmission of impurities and contaminants, surface damage from high-speed fluid injection, and resource wastage, especially at nanoscale dimensions, where patterned features are vulnerable to damage.
Innovation Solution
A gas-liquid two-phase atomizing cleaning device with a double jacket spray head, incorporating a rotating arm, gas guide tube, and liquid guide tube, uses pneumatic valves to alternate between gas-liquid two-phase and single liquid phase cleaning processes, enhancing atomization and kinetic energy of the fluid to improve cleaning efficiency while minimizing damage through controlled fluid flow and drying capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high speed liquid phase fluid injection is used to clean wafer surface, then cleaning efficiency is improved, but pattern damage increases
Solution Approach 1:
The invention changes the physical parameters of the cleaning fluid by atomizing it into nanoscale droplets (1-100 nm diameter) instead of using continuous liquid phase flow. This parameter change allows the cleaning process to maintain high effectiveness while reducing the harmful impact on patterned features, as the atomized droplets have lower momentum and can be better controlled
Solution Approach 2:
The invention replaces the conventional mechanical liquid phase jet system with a gas-liquid two-phase atomizing system. By using gas (such as nitrogen or air) to atomize and carry the liquid cleaning agent, the system achieves better fluid dynamics control, reduced droplet size, and improved distribution uniformity, thereby reducing mechanical damage to sensitive patterns
2Productivity
If nanoscale droplets are injected at high speed, then cleaning effectiveness is improved, but droplets enter internal patterned features causing deeper damage
Solution Approach 1:
The invention introduces gas phase fluid as an intermediary carrier that atomizes and transports the liquid cleaning agent. The gas phase acts as a buffer that controls the delivery of liquid droplets, preventing them from entering deep into patterned features while maintaining cleaning effectiveness on the surface
Solution Approach 2:
The invention employs periodic alternation between gas phase only mode and gas-liquid two-phase mode. During gas phase only operation, the system allows evaporation and drying; during gas-liquid two-phase operation, cleaning occurs. This periodic action prevents continuous liquid injection that would cause droplet penetration and deeper damage
3Productivity
If conventional liquid phase cleaning is used, then impurities are removed, but transmission capability of impurities to fluid is unsatisfying
Solution Approach 1:
The invention changes the fluid state from continuous liquid phase to atomized gas-liquid two-phase flow. This parameter change dramatically increases the surface area to volume ratio of the cleaning fluid, improving the transmission capability of impurities from the wafer surface to the fluid and enhancing overall cleaning capability
4Productivity
If high speed fluid injection is used, then cleaning power is increased, but resource waste increases
Solution Approach 1:
The invention changes the fluid injection parameters by using atomized droplets instead of continuous high-volume liquid flow. This parameter change maintains cleaning power through increased surface area and improved impurity transmission, while significantly reducing the total quantity of liquid required, thereby reducing resource waste
Solution Approach 2:
The invention replaces the liquid phase mechanical injection system with a gas-liquid two-phase atomizing system. This substitution improves fluid utilization efficiency by ensuring that the cleaning agent is delivered more effectively to the wafer surface, reducing waste of cleaning resources
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively increases the transmission of impurities and contaminants, reduces resource usage, and minimizes damage to patterned features by alternating cleaning processes and utilizing gas phase fluid for drying, thereby enhancing cleaning efficiency and reducing waste.
Implementation Method 1
the injected fluid is in an atomized form consisted of thousands of nanoscale droplets
Implementation Method 2
a gas-liquid two-phase atomizing cleaning device comprising: a gas-liquid two-phase spray head which is a double jacket structure
Implementation Method 3
under the high speed impact force of the fluid flow as well as the centrifugal force of the wafer rotation
Implementation Method 4
the gas guide tube and the liquid guide tube are both provided with pneumatic valves
Implementation Method 5
utilizing gas phase fluid for drying
Data Source
AI summary
The present invention provides a gas-liquid two-phase atomizing cleaning device. The cleaning device comprises a gas-liquid two-phase atomizing spray head. The spray head is a double jacket structure and comprises a nozzle, a rotating arm, a gas guide tube and a liquid guide tube; wherein the nozzle is connected with the rotating arm, the gas guide tube and the liquid guide tube are fixed to the rotating arm, the gas guide tube and the liquid guide tube are both provided with pneumatic valves.