Gas Delivery Manifold With Air-Gap Thermal Isolation

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Solution Overview

Problem

Existing gas delivery manifolds struggle to maintain high temperature precursor gases without dissipating thermal energy, leading to condensation and inefficiencies in semiconductor manufacturing processes.

Innovation Solution

A 3D printed monolithic gas delivery manifold with thermal block, air gaps, and embedded cooling channels for precise thermal control, allowing localized heating and reduced thermal dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the input of the gas delivery manifold is heated to maintain high temperature precursor gas, then the gas temperature is improved, but thermal energy is dissipated into the remainder of the gas delivery manifold

Engineering Contradiction:
Improvegas temperatureVSAvoidthermal energy dissipation
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The gas delivery manifold is segmented into a heated zone (thermal block with gas input) and unheated zones (remainder of manifold), allowing selective heating only where needed. The thermal block is physically separated from the rest of the manifold structure, creating distinct thermal zones that prevent heat propagation to unneeded areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An air gap acts as a thermal intermediary or insulator between the heated thermal block and the unheated portions of the gas delivery manifold. This air gap blocks thermal conduction, preventing heat from the thermal block from dissipating into the remainder of the manifold structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If high power is used to maintain gas at desired temperature, then the gas temperature stability is improved, but energy consumption increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The heating function is segmented and localized to only the thermal block portion of the manifold, rather than heating the entire manifold structure. This reduces the total mass that needs to be heated and maintained, thereby reducing power consumption while maintaining temperature stability in the critical gas delivery region.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The thermal properties of the manifold are made non-uniform through the air gap design. The thermal block region has high thermal mass and heating capability for temperature stability, while the unheated regions connected via air gap have low thermal conductivity, creating local quality differences that reduce overall energy consumption.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Maintains high temperature precursor gases efficiently, preventing condensation and enhancing manufacturing outcomes by minimizing thermal energy dispersion.

Implementation Method 1

an air gap is provided between at least a portion of the thermal block and a portion of the base

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

The input of the gas delivery manifold may be heated in order to obtain the necessary temperature of the gas through the gas delivery manifold

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS20260009130A1High temperature precursor gas delivery manifold
Publication Date: 2026.01.08 APPLIED MATERIALS INC
  • US20260009130A1 patent drawing
  • US20260009130A1 patent drawing
  • US20260009130A1 patent drawing

AI summary

Embodiments described herein relate to an apparatus that includes a thermal block with a gas inlet, and a gas line fluidly coupled to the gas inlet of the thermal block. In an embodiment, a base is coupled to the thermal block, where the base includes an embedded channel coupled to a fluid inlet. In an embodiment, an air gap is provided between at least a portion of the thermal block and a portion of the base.