Gas-Permeable Workpiece Chuck for Uniform Dielectric Film Bonding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The semiconductor industry faces challenges in creating smaller and more creative packaging techniques for semiconductor dies, particularly in Package-on-Package (PoP) technology, where efficient integration and component density are crucial.

Innovation Solution

A workpiece handling apparatus with a gas permeable buffer layer and vacuum system is used to securely attach a dielectric film to a semiconductor package, ensuring even bonding and patterning, while a robotic device facilitates precise placement and patterning of conductive bumps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a rigid supporting platform is used to hold the workpiece, then structural strength and stability are improved, but the bonding uniformity and surface contact quality deteriorate due to inability to adapt to surface irregularities

Engineering Contradiction:

Improvestructural strengthVSAvoidbonding uniformity

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent introduces a flexible buffer layer made of elastomeric material between the rigid supporting platform and the workpiece. This flexible layer can deform to conform to surface irregularities, ensuring uniform contact and bonding across the entire workpiece surface while the rigid platform maintains structural strength.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The system combines rigid and flexible materials in a composite structure. The rigid supporting platform provides structural strength, while the flexible elastomeric buffer layer provides adaptability and uniform contact, creating a composite system that achieves both strength and bonding uniformity simultaneously.

Inventive Principle:

Principle #40Composite materials

2Force

If a vacuum system is applied directly to the supporting platform, then workpiece holding force is improved, but the vacuum distribution uniformity deteriorates due to surface irregularities

Engineering Contradiction:

Improveholding forceVSAvoidvacuum distribution uniformity

Core Design Contradiction:

ForceVSManufacturing precision

Solution Approach 1:

The flexible buffer layer acts as an intermediary that transmits vacuum force uniformly across the workpiece surface. Its elastomeric properties allow it to deform and maintain consistent contact, ensuring uniform vacuum distribution even when the workpiece surface has irregularities.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The buffer layer serves as an intermediary between the vacuum system and the workpiece. It mediates the transmission of vacuum force, distributing it uniformly across the workpiece surface while isolating the vacuum system from direct contact with surface irregularities.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If the buffer layer is made of hard material, then structural support is improved, but the adaptability to workpiece surface variations and bonding quality deteriorate

Engineering Contradiction:

Improvestructural supportVSAvoidadaptability to surface variations

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The buffer layer is specifically designed as a thin film of elastomeric material that provides flexibility and adaptability. This thin flexible film can conform to surface variations while still providing adequate support, achieving both adaptability and sufficient structural function.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the material parameter from hard to elastomeric (flexible) to achieve adaptability. The elastomeric material's ability to deform elastically allows it to adapt to surface variations while maintaining sufficient mechanical support through its elastic recovery and distributed force transmission.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient and reliable attachment of dielectric films to semiconductor packages, enhancing integration and component density, and facilitating the manufacturing of high-density semiconductor devices with improved functionalities.

Implementation Method 1

a suction force provided by the vacuum system to secure the dielectric film on the gas permeable buffer layer

Methodology Applied

Scientific EffectVacuum: Vacuum

Implementation Method 2

a gas permeable buffer layer covering a supporting surface of the porous supporting platform, wherein a suction force provided by the vacuum system is passed through the gas permeable buffer layer to secure a workpiece on the gas permeable buffer layer

Methodology Applied

Scientific EffectGas permeation: Permeation

Data Source

PatentUS12500113B2Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package

Publication Date: 2025.12.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.