Gas-Permeable Package Lid With Embedded Membrane Bonding

Solution Overview

Problem

Current gas sensors with hydrophobic gas-permeable membranes experience poor adhesion due to their hydrophobic properties, leading to durability issues and unreliable bonding with the adhesive, which affects their environmental tolerance and long-term operation.

Innovation Solution

A gas-permeable package lid structure with an integrally formed lid body and embedded hydrophobic gas-permeable membrane, where the membrane is bonded to the lid body and shielded through holes, eliminating the need for additional fixation processes and enhancing stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a hydrophobic gas-permeable membrane is fixed on the gas sensor's air inlet through an adhesive after chip packaging, then the gas sensor can provide hydrophobic function, but the poor adhesion caused by hydrophobic property leads to poor bonding and affects durability

Engineering Contradiction:

Improvebonding reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The gas-permeable membrane is embedded into the lid body during the lid formation process before the gas sensor is packaged. This preliminary action ensures the membrane is securely positioned and bonded to the lid body through integral formation, eliminating subsequent adhesion problems when fixing the membrane to the packaged sensor.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The gas-permeable membrane is combined with the lid body through integral formation, merging two separate components (membrane and lid) into a single integrated structure. This eliminates the need for separate adhesive bonding processes and ensures reliable connection.

Inventive Principle:

Principle #5Merging (Combining)

2Duration of action of stationary object

If a hydrophobic gas-permeable membrane is fixed through adhesive bonding after chip packaging, then the gas sensor can be assembled, but the poor adhesion causes the membrane to detach easily, affecting long-term operation

Engineering Contradiction:

Improveservice lifeVSAvoidbonding durability

Core Design Contradiction:

Duration of action of stationary objectVSReliability

Solution Approach 1:

The gas-permeable membrane is embedded into the lid body during the lid formation process before the gas sensor is packaged. This preliminary action ensures the membrane is securely positioned and bonded to the lid body through integral formation, eliminating subsequent adhesion problems when fixing the membrane to the packaged sensor.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive bonding mechanism is replaced with a mechanical embedding structure. The membrane is physically embedded into the lid body through integral formation, providing mechanical retention that is more reliable than chemical adhesion for hydrophobic materials.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If additional fixation processes are used to secure the hydrophobic gas-permeable membrane, then bonding reliability improves, but manufacturing complexity and costs increase

Engineering Contradiction:

Improvebonding reliabilityVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The gas-permeable membrane is combined with the lid body through integral formation, merging two separate components (membrane and lid) into a single integrated structure. This eliminates the need for separate adhesive bonding processes and ensures reliable connection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lid body structure itself provides the fixation function through integral formation with the membrane. The lid body serves dual purposes: protecting the gas sensor and securing the membrane, eliminating the need for additional fixation components or processes.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The embedded hydrophobic gas-permeable membrane is securely positioned, preventing detachment and improving the reliability of the gas sensor, while reducing process and material costs, allowing for better environmental tolerance and long-term operation.

Implementation Method 1

A packaging material in liquid state is cured into a lid body

Methodology Applied

Scientific EffectCuring: Phase Change

Implementation Method 2

hydrophobic gas-permeable membrane

Methodology Applied

Scientific EffectGas permeability: Permeation

Implementation Method 3

hydrophobic gas-permeable membrane

Methodology Applied

Scientific EffectHydrophobicity: Hydrophobe

Data Source

PatentUS12191219B2Gas-permeable package lid of chip package structure and manufacturing method thereof

Publication Date: 2025.01.07 IND TECH RES INST

AI summary

A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.