Gas-Phase Thermal Interface for Electronic Cooling
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Solution Overview
Problem
Current cooling methods for electronic devices, particularly integrated circuits, face challenges in efficiently removing heat due to increased power generation, leading to overheating during test and burn-in processes, and existing thermal interface materials can cause corrosion and residue buildup, compromising structural integrity and reliability.
Innovation Solution
A system and method utilizing a mixture of atomized liquid and carrier gas fed to the gap between an electronic device and a heat sink, enhancing thermal conduction and mechanical compliance, which includes a bubbler, atomizer, and vacuum assembly to distribute micro liquid bumps surrounded by a carrier gas, effectively increasing thermal conductivity without damaging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal paste or propylene glycol is used as thermal interface material, then thermal conductivity is improved, but corrosion and residue buildup occur compromising device reliability
Solution Approach 1:
The patent introduces a gas phase intermediary (nitrogen or helium) between the chip and heat sink, eliminating direct contact with corrosive liquid thermal interface materials like propylene glycol. The gas acts as a mediator that transfers heat without causing corrosion or residue buildup, thus improving reliability while maintaining thermal conductivity.
Solution Approach 2:
The patent changes the physical state of the thermal interface material from liquid (thermal paste, propylene glycol) to gas phase (nitrogen, helium). This parameter change eliminates the corrosion and residue issues associated with liquids while maintaining or improving thermal conductivity through the gas phase.
2Ease of operation
If removable thermal interface materials are used for testing, then ease of operation is improved, but structural integrity may be compromised
Solution Approach 1:
The gas phase thermal interface material serves as a removable intermediary during testing that does not compromise structural integrity. Unlike liquid thermal pastes that may leave residue or require aggressive cleaning, the gas can be easily removed without damaging the chip or heat sink structure.
Solution Approach 2:
The patent uses inert gases (nitrogen or helium) that do not react with or damage the device structure. This inert environment allows for easy removal after testing without compromising the structural integrity of the chip or heat sink assembly.
3Productivity
If high power dissipation testing is performed, then productivity is improved, but overheating occurs reducing device reliability
Solution Approach 1:
The patent changes the thermal interface from liquid to gas phase, enabling higher power dissipation testing. The gas phase allows for better heat transfer at high power levels without the corrosion and residue issues that would compromise reliability during accelerated testing.
Solution Approach 2:
The patent utilizes phase transition properties of gases, which can rapidly absorb and dissipate heat during phase changes. This enables high power dissipation testing while maintaining device reliability through efficient heat removal without thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved thermal conductivity, reduces the risk of corrosion, and enhances the reliability and throughput of electronic devices during accelerated testing, achieving up to three times better cooling performance than using a carrier gas alone while requiring less liquid, thus improving cost, quality, and reliability.
Implementation Method 1
enhance thermal conduction in the gap separating an electronic device from a heat sink
Implementation Method 2
a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap
Data Source
AI summary
Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.