Substrate Processing Gas Pipe Temperature Switching for Oxidation Control
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Solution Overview
Problem
The existing methods for processing substrates in semiconductor manufacturing fail to effectively suppress an increase in pipe temperature due to reactions between metal-containing pipe surfaces and oxygen-containing gases, leading to potential burnout of pipe accessories and contamination.
Innovation Solution
A technique involving a two-step process where the pipe is initially heated to a high temperature during the first process and then cooled to a lower temperature during the second process, using a specific sequence of gas supply and temperature control to prevent oxidation reactions and maintain pipe temperature within safe limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If oxygen-containing gas is supplied through a metal-containing pipe at high temperature, then substrate processing can be performed efficiently, but the pipe temperature increases due to reaction between the pipe surface and gas
Solution Approach 1:
The patent applies preliminary action by heating the pipe to a high temperature (first temperature) before supplying the oxygen-containing gas. This pre-heating creates a thermal barrier that prevents excessive temperature rise during gas supply, allowing efficient substrate processing while controlling pipe temperature increase.
Solution Approach 2:
The patent implements dynamics by dynamically adjusting the pipe temperature between two states: a first temperature (higher) during oxygen-containing gas supply to prevent excessive temperature rise, and a second temperature (lower) during other processes. This dynamic temperature control allows the system to optimize for different process requirements.
2Reliability
If the pipe is heated to high temperature to prevent reaction with oxygen-containing gas, then pipe temperature increase is suppressed, but pipe accessories may be damaged due to excessive heat
Solution Approach 1:
The patent uses dynamic temperature control to switch between a first temperature (higher, for preventing reaction during oxygen gas supply) and a second temperature (lower, for protecting accessories during other processes). This dynamic adjustment ensures pipe temperature stability while preventing damage to temperature-sensitive accessories.
Solution Approach 2:
The patent implements periodic action by alternately setting the pipe temperature to the first temperature during oxygen-containing gas supply and the second temperature during other processes. This periodic temperature adjustment protects accessories from excessive heat while maintaining pipe temperature stability when needed.
3Reliability
If the pipe temperature is maintained at high level during oxygen gas supply, then reaction between pipe and gas is suppressed, but contamination may occur from pipe material degradation
Solution Approach 1:
The patent applies preliminary action by pre-heating the pipe to a high temperature before supplying oxygen-containing gas. This pre-heating establishes a thermal state that suppresses reaction between the pipe material and gas, preventing contamination from pipe material degradation during the critical gas supply phase.
Solution Approach 2:
The patent uses parameter changes by adjusting the pipe temperature between a first temperature (higher, for suppressing reaction during oxygen gas supply) and a second temperature (lower, for preventing degradation during other processes). This parameter adjustment maintains reaction suppression when needed while preventing contamination from excessive heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses pipe temperature increases, preventing burnout and contamination, while improving substrate processing efficiency and reducing contamination risks.
Implementation Method 1
the second pipe is heated to a first temperature or higher
Implementation Method 2
a temperature of the second pipe is lowered to a second temperature lower than the first temperature
Data Source
AI summary
There is provided a technique that includes (a) performing a first process to a substrate accommodated in a process container by supplying a first processing gas into the process container through a first pipe different from a second pipe, which is connected to the process container and includes an inner surface made of a metal-containing material, in a state in which the second pipe is heated to a first temperature or higher and (b) performing a second process to the substrate by supplying a second processing gas containing oxygen into the process container through the second pipe in a state in which a temperature of the second pipe is lowered to a second temperature lower than the first temperature.