Gas Distribution Plate Dry Cleaning for Hole Size Preservation
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Solution Overview
Problem
Conventional chemical cleaning methods for gas distribution plates in chemical vapor deposition systems enlarge the gas flow holes, reducing the plate's lifespan and increasing operational costs due to frequent replacements.
Innovation Solution
A dry cleaning method using ultrasonic waves is employed to remove lower density film deposits from the gas distribution plate, followed by chemical cleaning for remaining high density deposits, extending the plate's useful life and maintaining uniform gas flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chemical cleaning methods are used to clean gas distribution plates, then the deposited film is removed from the gas flow holes, but the gas flow holes are enlarged and the distribution plate lifespan is reduced
Solution Approach 1:
The patent replaces chemical cleaning methods with a mechanical cleaning system that uses a robotic end effector equipped with cleaning elements (such as brushes or abrasives) to physically remove deposited film from gas distribution plates. This mechanical approach eliminates the need for chemical solutions that cause corrosion and hole enlargement, thereby preserving the original hole dimensions and extending plate lifespan while maintaining cleaning effectiveness.
2Productivity
If chemical cleaning is performed frequently to maintain gas flow, then the gas distribution plate functionality is maintained, but operational costs increase due to frequent replacements
Solution Approach 1:
The patent implements a self-service cleaning system where the gas distribution plate is cleaned in-situ within the processing chamber using a robotic end effector. The plate cleans itself without requiring removal from the chamber or shutdown of the processing system, eliminating downtime associated with plate replacement and reducing operational costs by extending plate lifespan through non-destructive cleaning.
3Ease of manufacture
If the gas distribution plate is cleaned chemically, then the deposited film is removed, but the cleaning process requires removal of the backing plate and sending to third party cleaning houses
Solution Approach 1:
The patent creates a multi-functional integrated system where the robotic end effector with cleaning elements can clean multiple gas distribution plates of different sizes and configurations using the same basic mechanism. The system is designed to accommodate various plate geometries and can perform cleaning operations within the processing chamber itself, eliminating the need for external third-party cleaning facilities and simplifying the overall cleaning process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dry cleaning process doubles the lifespan of the gas distribution plate, reducing the frequency of chemical cleaning and associated costs while ensuring consistent gas flow and deposition quality.
Implementation Method 1
Ultrasonic waves are directed from the nozzle at the deposited film in the gas passages
Implementation Method 2
A vacuum nozzle is directed into communication with the gas passages in the gas distribution plate
Data Source
AI summary
Embodiments of the present disclosure generally relate to a method of dry cleaning a gas distribution plate for a plasma processing system. The method begins by exposing one or more of the gas passages in the gas distribution plate to a dry cleaning tool. Ultrasonic waves are directed from the nozzle at the deposited film in the gas passages. The film particles comprised of a lower density portion of the deposited film are removed away from the gas distribution plate by the dry cleaning tool. The method continues by indexing the nozzle of the dry cleaning tool across the gas distribution plate.