Gas Distribution Plate Layout for Uniform Plasma Density
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Solution Overview
Problem
Existing plasma processing apparatuses struggle to maintain uniform plasma density, particularly when forming patterns with high aspect ratios in semiconductor manufacturing.
Innovation Solution
The proposed plasma processing apparatus includes a gas distribution plate (GDP) with a specific arrangement of nozzles and a dual splitter system to selectively supply acceleration and deceleration gases, allowing for precise control of plasma density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional gas distribution system is used, then the apparatus structure is simple, but the plasma density is non-uniform across the substrate
Solution Approach 1:
The gas distribution plate is segmented into multiple nozzle groups (central nozzles, middle nozzles, outer nozzles) that are independently controllable. Each group supplies process gas to a specific radial zone of the substrate, allowing independent optimization of plasma density in each zone to achieve overall uniformity.
Solution Approach 2:
Different nozzle groups are equipped with independent flow control capabilities, enabling local adjustment of gas flow rates. The central, middle, and outer nozzle groups can be controlled to provide different gas flow characteristics matched to the specific plasma density requirements of their respective substrate zones.
2Quantity of substance
If acceleration gas is supplied to increase plasma density, then the plasma density increases, but the density becomes non-uniform
Solution Approach 1:
The acceleration gas supply is segmented and distributed through specific nozzle groups (central and middle nozzles) rather than uniformly across all nozzles. This localized acceleration gas supply allows increasing plasma density in specific zones where it is needed while maintaining uniformity across the entire substrate.
Solution Approach 2:
Acceleration gas is supplied locally through selected nozzle groups with independent flow control. The central and middle nozzle groups can be configured to provide acceleration gas to zones requiring higher plasma density, while outer nozzles may not receive acceleration gas, creating a tailored plasma density distribution that achieves overall uniformity.
3Manufacturing precision
If multiple nozzle groups with independent control are implemented, then plasma density uniformity is improved, but the device complexity increases
Solution Approach 1:
The system is segmented into a finite number of nozzle groups (central, middle, outer) with a limited set of independent flow controllers. This segmentation provides sufficient zones for plasma density control without excessive complexity, balancing uniformity achievement with manageable system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables uniform control of plasma density across the substrate, enhancing the capability to form patterns with high aspect ratios in semiconductor manufacturing.
Implementation Method 1
a plurality of middle nozzles connected to the main splitter and to the additional splitter, configured to spray the process gas and the acceleration gas
Implementation Method 2
a plasma processing apparatus configured to uniformly control plasma density
Data Source
AI summary
A plasma processing apparatus may include a support configured to receive a substrate, a gas distribution plate (GDP) including a plurality of nozzles facing the support, a main splitter configured to supply a process gas, and an additional splitter configured to supply an acceleration gas or a deceleration gas. The plurality of nozzles may include a plurality of central nozzles, a plurality of outer nozzles, a plurality of middle nozzles configured to spray the process gas and the acceleration gas, a plurality of first nozzles, and a plurality of second nozzles.