Gas Sensor Chip Thermal Management via Intermediary Cooling
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Solution Overview
Problem
Integrated physical quantity measuring devices for gases are prone to accuracy deterioration due to heat influences from other measuring units, aside from the gas being measured.
Innovation Solution
A physical quantity measuring device with a chip package molded from polymeric resin, including separate measuring units for different gas parameters and a signal processing unit, where a cooling unit is formed within the casing to allow gas flow between these units, reducing heat interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple measuring units are integrated in one device, then the number of parts is reduced and appearance is improved, but measurement accuracy deteriorates due to heat influence between units
Solution Approach 1:
The device is divided into multiple independent measuring units, each dedicated to measuring a specific physical quantity (flow rate, temperature, humidity, pressure). Each unit operates independently with its own sensing element, preventing heat interference between different measurement functions while maintaining integration within a single device housing.
Solution Approach 2:
A cooling unit is introduced as an intermediary component between the measuring units and the signal processing unit. This cooling unit actively removes heat generated by the signal processing unit and prevents it from affecting the measuring units, thereby maintaining measurement accuracy while allowing integration of multiple functions.
2Volume of moving object
If measuring units are closely integrated, then device size is reduced, but heat interference from other units affects measurement accuracy
Solution Approach 1:
The device is segmented into functionally independent measuring units, each capable of operating autonomously. This segmentation allows the units to be closely integrated in space while maintaining thermal independence through the cooling unit, thus achieving compact size without sacrificing measurement precision.
Solution Approach 2:
The thermal parameters of the device are actively managed by introducing a cooling unit that changes the temperature parameter of the signal processing unit, preventing heat accumulation and thermal interference in the integrated structure, thereby maintaining measurement accuracy in a compact form factor.
3Device complexity
If signal processing unit is integrated with measuring units, then device complexity is reduced, but heat from signal processing unit affects measuring unit accuracy
Solution Approach 1:
The cooling unit serves as a thermal intermediary between the signal processing unit and the measuring units. It actively cools the signal processing unit and prevents heat transfer to the measuring units, enabling close integration of processing and sensing functions while maintaining measurement accuracy through thermal isolation.
Solution Approach 2:
The cooling unit is integrated into the device structure and uses the measured gas flow itself as the cooling medium. The gas passing through the measuring units also serves to cool the signal processing unit, creating a self-regulating thermal management system that maintains measurement accuracy without requiring external cooling resources.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the impact of heat from other measuring units on the device, enhancing measurement accuracy and reliability.
Implementation Method 1
a cooling unit which allows the gas to be measured from the main passage to flow between the first measuring unit and the second measuring unit, and cools the signal processing unit
Data Source
Figure 1
Figure 2~3
Figure 4(A)~4(B)
AI summary
Provided is a physical quantity measuring device for reducing the influence of heat, other than the heat of a gas to be measured, on a measuring unit for measuring a physical quantity of the gas to be measured. The physical quantity measuring device according to the present invention includes a chip package 40 and a casing 11. The chip package 40 is molded from a polymeric resin, including first and second measuring units measuring first and second physical quantities of the gas to be measured, and a signal processing unit being connected to the first and second measuring units, and processing signals transmitted from the first and second measuring units, The casing 11 fixedly stores the chip package 40, and includes first and second bypass passages 12 and 14 allowing the gas to be measured taken from a main passage 70, to flow in the first measuring unit. In the chip package 40, the signal processing unit 44 is disposed between the first and second measuring units. In the casing 11, a cooling unit is formed for allowing the gas to be measured from the main passage 70 to flow between the first measuring unit and the second measuring unit, and cooling the signal processing unit 44.