Gas Sensor Conductor Segmentation for Sintering Reliability
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Solution Overview
Problem
Existing gas sensors with stacked ceramic layers face issues of reduced electrical connection reliability due to deformation during sintering, leading to clearance between ceramic layers, and inefficient use of conductive materials, which increases costs and decreases adhesion between layers.
Innovation Solution
The design incorporates a conductor configuration with a narrow lead portion and a wider contact portion, reducing the amount of conductive material used while enhancing adhesion and reliability by positioning the contact portion away from deformation-prone areas, and providing multiple lead portions for redundancy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elongated conductive portions are provided to establish electrical connection between ceramic layers, then electrical connection reliability is improved, but the amount of conductive material used increases
Solution Approach 1:
The conductor is divided into multiple distinct portions: a first conductive portion in the first ceramic layer, a second conductive portion in the second ceramic layer, and a bridge conductive portion connecting them. This segmentation allows each portion to be optimized for its specific function while reducing overall material usage compared to a single continuous elongated conductor.
Solution Approach 2:
The electrical connection is achieved by transitioning from a single-layer elongated conductor to a multi-layer stacked configuration. The bridge conductive portion extends in the thickness direction (z-axis) to connect conductors in different ceramic layers, utilizing the third dimension to reduce material usage in the planar directions.
2Reliability
If elongated conductive portions are provided to establish electrical connection, then electrical connection reliability is improved, but adhesion between ceramic layers decreases
Solution Approach 1:
By segmenting the conductive structure into separate portions in different ceramic layers connected by a bridge, the conductive material is concentrated in specific locations rather than spread out. This allows the ceramic layers to maintain better contact over larger areas, improving adhesion while still achieving reliable electrical connection through the bridge portion.
Solution Approach 2:
The bridge conductive portion is strategically positioned to extend from the peripheral conductive portion toward the center, creating a localized connection path. This local quality approach ensures electrical connection reliability at the connection point while minimizing the impact on overall layer adhesion.
3Quantity of substance
If conductive material is reduced to lower costs, then manufacturing cost decreases, but electrical connection reliability may deteriorate
Solution Approach 1:
The segmented conductor structure with bridge portions allows for optimized material distribution. Each conductive portion is sized and positioned to provide necessary electrical connection while avoiding excessive material usage, achieving cost reduction without sacrificing reliability.
Solution Approach 2:
By utilizing the thickness direction to create bridge conductive portions that connect ceramic layers, the design reduces the need for extensive planar conductor extensions. This dimensional approach maintains electrical connection reliability while minimizing the total amount of conductive material required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves electrical connection reliability, reduces conductive material usage, and enhances adhesion between ceramic layers, leading to a more stable and cost-effective gas sensor.
Implementation Method 1
the electrode and the lead portion are electrically interconnected by means of a through hole conductor formed in a through hole (a penetration hole) penetrating through the ceramic layers
Implementation Method 2
after a through hole 241h1 is bored in a ceramic layer 241, an unsintered through hole conductor 206 is formed on an inner peripheral surface of the through hole 241h1
Data Source
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AI summary
A gas sensor including: a gas sensing element (200) including first and second ceramic layers (241, 221). The first ceramic layer has a first through hole (241h1) and a first through hole conductor (271) covering an inner surface thereof. The first ceramic layer includes a first conductor (247) which includes: a first peripheral conductive portion (247c) electrically connected to the first through hole conductor (271); a first lead portion (247b) that is narrower than the first peripheral conductive portion (247c); and a first contact conductive portion (247a) that is wider than the first lead portion (247b). The first peripheral conductive portion (247c), the first lead portion (247b) and the first contact conductive portion (247a) are integrally formed and arranged in this order in a longitudinal direction. The second ceramic layer (221) includes a second conductor (222) electrically connected to at least the first contact conductive portion (247a).