Gas Sensor Package Flip Chip Bonding Adhesive Strength
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Solution Overview
Problem
Conventional gas sensors face issues with chip separation and distortion during manufacturing due to reduced adhesive strength, and exposure to external impacts, which affects their durability and integration with semiconductor processes.
Innovation Solution
A gas sensor package is designed using a flip chip bonding method with a conductive material layer, where a protective cap applies pressure to an epoxy adhesive part to enhance adhesive strength and simplify the manufacturing process, and a metal pattern layer facilitates gas movement, while a cover member seals the gas sensing element to improve sensitivity and protect against radiant heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the gas sensor element is mounted on the substrate using a soldering process, then the gas sensor can be integrated with semiconductor process technology, but the adhesive strength is reduced causing chip separation and location distortion during manufacturing
Solution Approach 1:
The patent changes the mounting method from traditional soldering to flip chip bonding, which fundamentally alters the bonding parameters and process characteristics to achieve both good adhesion and semiconductor process compatibility
Solution Approach 2:
The patent replaces the mechanical soldering process with a flip chip bonding method that uses controlled mechanical pressure and thermal processing, substituting one mechanical system with another that better satisfies both adhesion and integration requirements
2Ease of manufacture
If the gas sensor element is mounted on the substrate using a soldering process, then the gas sensor can be integrated with semiconductor process technology, but chip separation and location distortion occur during manufacturing due to vibrations
Solution Approach 1:
The patent changes the mounting method from traditional soldering to flip chip bonding, which fundamentally alters the bonding parameters and process characteristics to achieve both good adhesion and semiconductor process compatibility
Solution Approach 2:
The flip chip bonding process performs the mounting operation before subsequent manufacturing steps, ensuring chip location is established early and maintained throughout the manufacturing process, preventing distortion during later handling
3Device complexity
If the gas sensor element is exposed to the substrate, then the structure is simple, but the gas sensor element is damaged by external impact
Solution Approach 1:
The patent applies a protective coating layer over the gas sensor element before the element is exposed to the environment, providing beforehand protection against external impacts while maintaining the relatively simple overall structure
Solution Approach 2:
The patent uses a thin film protective coating that covers the gas sensor element, providing impact protection while maintaining structural simplicity and not significantly increasing device complexity
4Reliability
If a protective cap applies pressure to an epoxy adhesive part, then adhesive strength is enhanced and production defects are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The protective cap applies pressure to the epoxy adhesive part during the bonding process to ensure proper adhesion, and this pressure application is built into the standard manufacturing流程, making the process complexity acceptable while achieving reliable bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution strengthens adhesive bonds, reduces production defects and costs, miniaturizes the sensor package, and enhances gas sensing efficiency by ensuring stable gas flow and protection of the sensing element.
Implementation Method 1
an adhesive part that adheres the protective cap to the substrate and comes into contact with at least one portion of the gas sensing element
Data Source
AI summary
Provided is a gas sensor package, including: a gas sensing element; and a substrate on which the gas sensing element is disposed, in which a through hole corresponding to the gas sensing element is formed.