Slim Gas Sensor Package via Flip Chip Bonding

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Solution Overview

Problem

Conventional gas sensor packages face challenges in miniaturization due to their bulky structure resulting from the use of cap members and mesh-shaped ventilation systems, which increase the size and production costs while limiting integration with semiconductor processes.

Innovation Solution

A slim gas sensor package is achieved by using a flip chip bonding method to mount the gas sensing element directly onto a substrate with a gas inflow hole, eliminating the need for separate cap members and mesh structures, and incorporating metal patterns and filling portions for efficient gas flow and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cap member and mesh-shaped member are used to protect the gas sensing material, then the gas sensing element is protected, but the package size increases significantly

Engineering Contradiction:

Improveprotection of gas sensing elementVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent removes the cap member and mesh-shaped member from the package structure, eliminating the need for these protective components while still allowing gas to reach the sensing element through the substrate's gas inflow hole, thereby significantly reducing package size

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate itself acts as a thin film structure that integrates the gas inflow hole directly, replacing the need for separate protective caps and mesh structures while maintaining gas permeability and sensing functionality

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If a wire bonding method is used to connect the sensor chip to the electrode part, then electrical connection is achieved, but the entire size of the gas sensing package increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent combines the gas sensing element, substrate, and electrode connections into a single integrated structure where the sensing element is directly mounted on the substrate with metal patterns, eliminating the need for separate wire bonding processes and reducing overall package size

Inventive Principle:

Principle #5Merging (Combining)

3Ease of operation

If a separate cap member and mesh-shaped member are provided, then gas ventilation is enabled, but the height of the upper structure increases

Engineering Contradiction:

Improvegas ventilationVSAvoidheight of upper structure

Core Design Contradiction:

Ease of operationVSLength of stationary object

Solution Approach 1:

The patent extracts and eliminates the cap member and mesh-shaped member, replacing them with a direct gas inflow hole through the substrate, thereby enabling gas ventilation without increasing the height of the upper structure

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The gas inflow hole is formed through the substrate in a vertical dimension, allowing gas to reach the sensing element directly without requiring additional horizontal space for caps or mesh structures, thus reducing the overall height of the package

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP2857349B1Gas sensor package

Publication Date: 2020.08.05 LG INNOTEK CO LTD

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AI summary

Provided is a gas sensor package including a first substrate (210) including a gas inflow hole (220), and a gas sensing element (100) mounted to the first substrate (210) and including a gas sensing portion (110) disposed to correspond to the gas inflow hole (220).