Gas Sensor Package Flip Chip Bonding Ventilation
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Solution Overview
Problem
Conventional gas sensor packages face challenges in miniaturization and cost due to the use of bonding wires and structural limitations that hinder efficient ventilation and heat management, leading to increased size and manufacturing costs.
Innovation Solution
The implementation of a flip chip bonding method directly bonds the gas sensing element to the substrate, eliminating the need for bonding wires and incorporating ventilation holes in the protective cap for efficient gas flow and heat dissipation, while using a metal protective cap for shock resistance and a surface treatment layer to prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cap member and mesh-shaped member are added to protect the gas sensing material, then reliability is improved, but the package size increases significantly
Solution Approach 1:
The protective cap member and mesh-shaped member are merged into a single integrated component. The mesh-shaped member is formed directly on the upper surface of the cap member, eliminating the need for separate protective structures and reducing overall package size while maintaining protection and ventilation functions.
Solution Approach 2:
The cap member is designed to perform multiple functions simultaneously: it protects the gas sensing material from damage, provides structural support, and enables gas ventilation through the integrated mesh-shaped member. This multi-functionality reduces the number of separate components needed.
2Reliability
If a wire bonding method is used to connect the sensor chip to the electrode part, then connection reliability is improved, but the package size increases due to the height of the upper structure
Solution Approach 1:
The bonding wire is extracted and eliminated from the system. Instead of using wire bonding to connect the sensor chip to the electrode part, the invention uses direct bonding through the integrated cap member structure, removing the need for additional height to accommodate bonding wires.
3Productivity
If the mesh-shaped member is formed on the cap member for gas ventilation, then gas sensing efficiency is improved, but the package size increases
Solution Approach 1:
The mesh-shaped ventilation member is merged with the cap member into a single integrated component. The mesh structure is formed directly on the cap member's upper surface, providing effective gas ventilation pathways without requiring additional space for separate ventilation components.
Data Source
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Figure 3
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AI summary
Provided is a gas sensor package having high sensing efficiency and a high bonding ability, including: a first substrate (210) including a metal pattern; a gas sensing element (100) mounted on the first substrate and having a gas sensing part (110) disposed to face a surface of the first substrate; and a protective cap (30) disposed on the first substrate and having a receiving space intended for receiving the gas sensing element, the protective cap including a first ventilation hole (35) passing through the receiving space and an exterior.