Gas Sensor Single-Substrate Manufacturing via Ink-Jet Printing

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Solution Overview

Problem

Conventional semiconductor gas sensors face challenges in forming various types on a single substrate due to high manufacturing costs and cross contamination issues associated with multiple photomasks and chambers.

Innovation Solution

A gas sensor design that utilizes a single chamber for manufacturing multiple materials, employing three-dimensional printing or ink-jet printing methods to form semiconductor layers of different conductive types on a single substrate, eliminating the need for multiple photomasks and reducing contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional semiconductor manufacturing process with multiple photomasks is used to form various types of sensors on a single substrate, then the sensor types and functionality are improved, but the manufacturing cost increases

Engineering Contradiction:
Improvesensor typesVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent applies universality by designing a single substrate that can accommodate multiple types of gas sensors with different sensing materials (metal oxides, organic semiconductors, polymers) simultaneously. The substrate structure includes multiple heating elements and electrode configurations that can support diverse sensor types, eliminating the need for separate manufacturing processes for each sensor type and reducing overall manufacturing cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the substrate into multiple independent sensor regions, each capable of hosting different sensing materials and configurations. This segmentation allows various sensor types to be formed on a single substrate without requiring multiple complete substrates or complex photomask processes, thereby reducing manufacturing cost while maintaining versatility.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple chambers are used for manufacturing processes on variety of materials, then the material diversity and sensor functionality are improved, but the risk of cross contamination increases

Engineering Contradiction:
Improvematerial diversityVSAvoidcross contamination risk
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent merges multiple manufacturing processes onto a single substrate in a sequential manner. Different sensing materials are deposited and processed on the same substrate without transferring to separate chambers, thereby eliminating cross-contamination risks associated with multiple chambers while maintaining material diversity through careful process sequencing and material compatibility selection.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If various types of sensors are formed on a single substrate, then the selectivity and sensitivity are improved, but the manufacturing complexity increases

Engineering Contradiction:
Improveselectivity and sensitivityVSAvoidmanufacturing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating distinct sensor regions on the substrate, each optimized for specific sensing materials and configurations. Different areas of the substrate have tailored heating elements, electrode patterns, and material compositions to achieve optimal selectivity and sensitivity for specific gas detection applications, while the overall manufacturing process remains simplified through single-substrate integration.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10473607B2Gas sensor
Publication Date: 2019.11.12 WINBOND ELECTRONICS CORP
  • US10473607B2 patent drawing
  • US10473607B2 patent drawing
  • US10473607B2 patent drawing

AI summary

A gas sensor includes a first substrate, at least one first electrode, a sensing structure, at least one second electrode, and a second substrate. The at least one first electrode is located on the first substrate. The sensing structure is located on the at least one first electrode and the first substrate, and the sensing structure includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer having a first conductive type covers the first substrate and the at least one first electrode; the second semiconductor layer having a second conductive type is located on the first semiconductor layer. The at least one second electrode covers the sensing structure. The second substrate covers the at least one second electrode and the sensing structure.