Gas Sensor Lead Frame with Variable Thickness Die Pad
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Solution Overview
Problem
Current gas sensors lack a compact design and high precision measurement capabilities, particularly when integrating a light receiving element, light emitting element, and an integrated circuit for gas concentration calculation.
Innovation Solution
A gas sensor design incorporating a light receiving element, light emitting element, integrated circuit, lead frame, and sealing member, where the lead frame includes die pad and terminal portions with varying thickness regions, allowing for efficient packaging and precise electrical connections, enabling miniaturization and high precision measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a gas sensor includes a light receiving element, light emitting element, and integrated circuit for gas concentration calculation, then measurement precision is improved, but device size increases
Solution Approach 1:
The patent combines the light receiving element, light emitting element, and integrated circuit onto a single lead frame structure. The lead frame serves as a common mounting substrate for all components, integrating them into one compact assembly rather than using separate packages, thereby reducing overall sensor size while maintaining measurement precision
Solution Approach 2:
The lead frame utilizes a three-dimensional layered arrangement where components are positioned at different heights and depths within the package. The light receiving element and light emitting element are arranged on opposite sides with the integrated circuit interposed between them, creating an optimized spatial configuration that minimizes package volume
2Ease of manufacture
If the lead frame uses uniform thickness for die pad portion, then manufacturing is simplified, but temperature uniformity and measurement precision deteriorate
Solution Approach 1:
The die pad portion of the lead frame is designed with non-uniform thickness, featuring a first region with greater thickness and a second region with lesser thickness. This local variation in thickness allows different regions to serve different thermal functions, improving temperature uniformity across the mounted components and enabling better temperature characteristic compensation for enhanced measurement precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables a compact gas sensor with high precision measurement capabilities by uniformizing temperature within the package, allowing for precise temperature characteristic compensation and efficient infrared ray transmission, thus enhancing measurement accuracy.
Implementation Method 1
non-dispersive infrared-type optical gas concentration measuring apparatuses configured to, using a feature that the wavelength of absorbed infrared rays differs depending on the type of gas, measure gas concentration by detecting the amount of absorption of infrared rays
Implementation Method 2
the design enables a compact gas sensor with high precision measurement capabilities by uniformizing temperature within the package
Data Source
AI summary
A gas sensor includes a light receiving element, a light emitting element, an integrated circuit, a lead frame, and a sealing member configured to seal these into a package. The lead frame includes at least one die pad portion and a plurality of terminal portions, the die pad portion includes a first region having a first thickness and a second region having a second thickness thinner than the first thickness, the integrated circuit is arranged on the second region of the die pad portion, the light emitting element is electrically connected to at least one of the plurality of terminal portions, the light receiving element is electrically connected to the integrated circuit and is arranged on the opposite side to the light emitting element with the integrated circuit interposed therebetween, and the integrated circuit is electrically connected to at least one of the plurality of terminal portions.