Gas Sensor Package Output Mode Conversion
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Solution Overview
Problem
Conventional gas sensors face challenges in miniaturization due to increased size caused by separate cap members and mesh-shaped structures, which complicate integration with semiconductor processes and reduce sensing efficiency, especially when converting resistance output to voltage output, and are affected by temperature variations.
Innovation Solution
A gas sensor package with an integrated output change part using a negative temperature coefficient (NTC) thermistor and a simplified electrode structure, allowing for in-package conversion of resistance to voltage output and reducing the need for external components, along with a cover member that secures gas flow and minimizes package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate cap member and mesh-shaped member are provided to protect the sensing chip and allow gas ventilation, then the sensing efficiency and gas flow are improved, but the package height and overall size increase significantly
Solution Approach 1:
The cap member and mesh-shaped member are merged into a single integrated structure. The mesh-shaped member is formed on the upper surface of the cap member as a single component, eliminating the need for separate parts and reducing package height while maintaining protection and gas ventilation functions
Solution Approach 2:
The cap member serves multiple functions simultaneously: it protects the sensing chip from physical damage, provides gas ventilation through the integrated mesh structure, and maintains structural integrity. This multi-functional design reduces the number of components needed
2Reliability
If wire bonding method is used to connect the sensing chip to electrode part, then electrical connection is achieved, but the package size increases by several times to dozens of times
Solution Approach 1:
The wire bonding process and associated wiring structures are extracted and replaced with a direct bonding connection method. The sensing chip is directly bonded to the electrode pattern on the substrate, eliminating the need for external wire bonds and significantly reducing package volume
Solution Approach 2:
The mechanical wire bonding system is replaced with a direct material bonding system. The sensing chip electrodes are directly bonded to the substrate electrode pattern through material deposition or direct contact bonding, eliminating the mechanical wire insertion and welding process
3Adaptability or versatility
If resistance value is applied to sensing material for digital output conversion, then output mode conversion is achieved, but sensing efficiency is reduced due to temperature-dependent resistance changes
Solution Approach 1:
An NTC thermistor is introduced as an intermediary component to compensate for temperature-induced resistance changes in the sensing material. The thermistor's temperature-dependent resistance characteristics are used to counterbalance the sensing material's resistance drift, maintaining accurate digital output conversion across temperature variations
Solution Approach 2:
The resistance characteristics of the sensing material are compensated by changing the resistance parameter of the NTC thermistor based on temperature. The thermistor's resistance changes with temperature in a manner that counteracts the sensing material's resistance changes, stabilizing the overall output
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a miniaturized gas sensor package with improved sensing efficiency, reduced size, and increased reliability by compensating temperature-induced resistance changes and simplifying the circuit structure, while maintaining effective gas detection and ventilation.
Implementation Method 1
an output change part mounted to the substrate and configured for changing an output mode of the gas sensing element
Implementation Method 2
a semiconductor type using a change of resistance values according to a change in the amount of gas
Implementation Method 3
an oscillator type using a change in an oscillation frequency generated when gas is absorbed onto an oscillator
Data Source
AI summary
A gas sensor package is configured such that an output change part is provided in the gas sensor package including a gas sensor so that a resistance output mode can be changed to a voltage output mode, thereby enabling the gas sensor to have a regular initial voltage value by compensating a resistance change value to an initial gas sensing material. According to embodiments of the present application, a gas sensor package is configured such that a gas moving separation part is formed between a gas sensing element and a substrate with regard to a structure in which a gas sensing element is mounted to the substrate in a flip chip bonding method so that gas can be smoothly moved and thus gas sensing efficiency can be maximized.