Gas Sensor Thin-Film Heating Structure for Thermal Stress Cancellation
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Solution Overview
Problem
The deformation of the film structure in gas sensors due to thermal stresses caused by prolonged heating affects the detection sensitivity and stability of the sensor.
Innovation Solution
A sensor element with a double-layer structure comprising a first and second heating resistor, positioned on opposite sides of the thin film, where the thermal stresses induced by each resistor cancel each other out, preventing film deformation and ensuring stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single heating resistor is used to heat the thin film, then the gas sensor can detect gases effectively, but thermal stresses cause deformation of the film structure and change in resistance characteristic
Solution Approach 1:
The heating function is segmented into two separate heating resistors positioned on opposite sides of the thin film. This segmentation allows the thermal stresses to be independently controlled and canceled out, preventing film deformation while maintaining heating effectiveness for gas detection.
Solution Approach 2:
The second heating resistor acts as a counterweight to the first heating resistor by generating opposite thermal stresses. The thermal stress from the first resistor is canceled by the second resistor, effectively neutralizing the deformation effect while both contribute to heating the thin film.
2Measurement precision
If heating is applied to improve response and detection sensitivity, then the gas sensor becomes more sensitive, but prolonged heating causes thermal stresses leading to film deformation
Solution Approach 1:
Different regions of the thin film are heated locally by resistors positioned on opposite sides. The first heating resistor heats the lower surface while the second heating resistor heats the upper surface, creating localized thermal zones that cancel each other's deformation effects while maintaining overall heating for sensitivity.
Solution Approach 2:
The invention utilizes thermal expansion effects by positioning heating resistors on opposite sides of the thin film. The thermal expansion stresses generated by each resistor are equal and opposite, causing them to cancel each other out and prevent net deformation of the film structure during prolonged heating.
3Stability of the object's composition
If a double-layer structure with two heating resistors is used, then thermal stresses cancel out and film deformation is prevented, but the device complexity increases
Solution Approach 1:
Both heating resistors serve multiple functions: they generate thermal stress for cancellation, provide heating for gas detection, and their overlapping linear segments at end portions enable both stress compensation and thermal coupling. This multi-functionality reduces the need for additional compensation structures.
Solution Approach 2:
The harmful thermal stresses that would normally cause deformation are converted into a beneficial cancellation mechanism. By positioning the second heating resistor to generate opposite thermal stress, the harmful effect of thermal expansion is transformed into a useful stress compensation system that stabilizes the film structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces thermal stress-induced deformation, stabilizing the resistance characteristics and ensuring stable performance of the gas sensor.
Implementation Method 1
The heating element can improve response of the gas sensor to gases and increase detection sensitivity
Implementation Method 2
the heat energy generated by the heating inside the gas sensor would cause thermal stresses, which may lead to a deformation of the film structure
Data Source
AI summary
The disclosure discloses a sensor element and a gas sensor, comprising a substrate and a thin film arranged on the substrate; The substrate is provided with a cavity and an opening in communication with the cavity; The thin film is supported on the opening and partially covers the cavity; The thin film comprises first and second heating resistors, each of which is shaped in a meander line, the first heating resistor is positioned on a side of the thin film near the cavity, and the second heating resistor is positioned on a side of the thin film away from the cavity; and a linear segment at an end portion of the first heating resistor is at least partially overlapped with a linear segment at an end portion of the second heating resistor, to allow the thermal stresses to cancel out each other.


