GaAs-Si Composite Substrate for Light Emitting Devices
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Solution Overview
Problem
The challenge is to create a light emitting device that can form light emitting elements on a suitable substrate without damaging it, as existing GaAs substrates are weak and prone to cracking during manufacturing.
Innovation Solution
A light emitting device is designed with a first substrate, such as GaAs, reinforced by a second substrate like silicon, which is bonded directly to the first substrate to enhance mechanical strength and reduce refraction and reflection, with lenses formed on the second substrate to shape the emitted light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a GaAs substrate is used to form light emitting elements, then the light emitting elements can be formed on a suitable substrate, but the GaAs substrate may be cracked or chipped during manufacturing due to its weak strength
Solution Approach 1:
The patent uses a composite substrate structure where a GaAs layer is bonded to a Si substrate. The GaAs layer provides suitable properties for light emitting element formation, while the Si substrate provides high mechanical strength to prevent cracking or chipping during manufacturing. This composite approach combines the advantages of both materials to resolve the contradiction between ease of manufacture and substrate strength.
2Strength
If a second substrate is added to reinforce the first substrate, then the mechanical strength is improved, but the device complexity increases
Solution Approach 1:
The patent merges the functional GaAs substrate with a structural Si substrate into a single bonded composite structure. This integration allows the GaAs layer to maintain its light-emitting functionality while the Si substrate provides mechanical support, achieving reinforcement without significantly increasing device complexity as the two substrates work together as a unified structure.
3Strength
If different materials are used for the first and second substrates, then the mechanical strength is improved, but refraction and reflection of light between the substrates becomes more likely to occur
Solution Approach 1:
The patent carefully selects and controls the thickness parameters of the GaAs layer and Si substrate to optimize optical performance. By adjusting these dimensional parameters, the design minimizes the impact of refraction and reflection at the material interface while maintaining the mechanical strength benefits of using different materials. The specific thickness values are chosen to reduce optical losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the formation of light emitting elements on a reinforced substrate, preventing damage during manufacturing and improving the mechanical strength and light shaping capabilities of the device.
Implementation Method 1
the second substrate may be directly bonded to the first substrate
Implementation Method 2
a plurality of lenses that are provided on the fourth surface of the second substrate and on which light emitted from the light emitting elements is incident
Data Source
AI summary
There are provided a light emitting device capable of forming a light emitting element on a suitable substrate and a method of manufacturing the same.A light emitting device according to the present disclosure includes: a first substrate; a plurality of light emitting elements that are provided on a first surface of the first substrate; and a second substrate that is provided on a second surface of the first substrate opposite to the first surface.