Non-Contact Substrate Bonding via Gas Suction

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Solution Overview

Problem

In the bonding of electronic device substrates, such as semiconductor and flat panel displays, the use of electrostatic or vacuum chucks can cause substrate deformation and positional deviations, especially with thin substrates like silicon wafers, leading to potential damage and particle generation during the bonding process.

Innovation Solution

A bonding apparatus featuring a gas supply unit that uses nozzles to apply suction to substrates via cyclone or Bernoulli effects, allowing for precise control of gas flow rate and temperature to suspend and shape substrates without contact, maintaining their original form and facilitating accurate bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrostatic or vacuum chuck is used to retain substrate on mounting platform, then substrate can be held in place, but substrate deforms following the mounting face shape

Engineering Contradiction:

Improvesubstrate retentionVSAvoidsubstrate flatness

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent replaces the mechanical contact-based electrostatic or vacuum chuck system with a non-contact magnetic field-based retention system. The magnetic field exerts force on the substrate without physical contact, eliminating the transmission of mounting face irregularities to the substrate while maintaining effective retention.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a magnetic field as an intermediary between the mounting platform and the substrate. This magnetic field mediator transfers the retention function without requiring direct mechanical contact, thereby preventing substrate deformation from mounting face shape while maintaining secure holding.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If substrate is deformed into shape not suitable for processing, then substrate can be retained, but bonding position deviates from proper position

Engineering Contradiction:

Improvesubstrate retentionVSAvoidbonding position accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical contact retention that causes deformation with a magnetic field-based non-contact retention system. This substitution maintains substrate flatness and ensures accurate bonding positioning while achieving reliable substrate holding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If substrate contacts mounting face, then substrate can be retained, but substrate damage and particle generation occur

Engineering Contradiction:

Improvesubstrate retentionVSAvoidsubstrate damage and particles

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a magnetic field as an intermediary force that enables substrate retention without direct contact with the mounting face. This eliminates mechanical contact that causes substrate damage and particle generation while maintaining effective retention through magnetic attraction.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent substitutes the mechanical contact system with a magnetic field-based non-contact retention system, eliminating the harmful effects of direct contact including substrate damage and particle generation while maintaining reliable retention.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively prevents substrate deformation and damage by suspending substrates without contact, ensuring precise positioning and clean bonding, thus enhancing the bonding process efficiency and quality.

Implementation Method 1

supplying gas to the nozzle 12a2, and applying suction to the substrate W1 and separating the substrate W1 from the face 12a1 of the main body unit 12a by generating at least one of a cyclone effect and a Bernoulli effect

Methodology Applied

Scientific EffectCyclone effect: Cyclone Separation

Implementation Method 2

Methodology Applied

Scientific EffectBernoulli effect: Bernoulli Effect

Data Source

PatentUS9741596B2Bonding apparatus and bonding process method

Publication Date: 2017.08.22 SHIBAURA MECHATRONICS CORP

AI summary

According to one embodiment, a bonding apparatus for processing a retained substrate includes a main body unit, a nozzle, a gas supply unit, and a substrate support unit. The nozzle opens on a face of the main body unit on a side that a first substrate is retained. The gas supply unit is configured to supply gas to the nozzle, to apply suction to the first substrate and to separate the substrate from the face of the main body unit. The substrate support unit is configured to support a peripheral edge portion of a second substrate provided in opposition to the first substrate with a predetermined gap.