Gas Supply Unit With Diffusion Region For Uniform Deposition
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Solution Overview
Problem
Existing substrate processing systems face challenges in achieving uniform deposition of thin layers on substrates due to uneven gas supply and pressure gradients, leading to inconsistent film thickness and increased gas consumption.
Innovation Solution
A substrate processing system with a gas supply unit that includes a gas supply region with gas supply holes and a gas diffusion region without holes, positioned to create a separate space for gas diffusion between the supply region and the exhaust unit, allowing for uniform gas distribution and reduced pressure gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If gas supply holes are provided across the entire gas supply part, then gas supply coverage is improved, but gas distribution uniformity deteriorates due to direct exhaust pathways creating pressure gradients
Solution Approach 1:
The gas supply part is segmented into two distinct regions: a gas supply region with gas supply holes and a gas diffusion region without holes. This segmentation prevents direct exhaust pathways while maintaining gas supply coverage, allowing gas to diffuse uniformly before reaching the substrate and eliminating pressure gradient-induced non-uniformity in film deposition.
Solution Approach 2:
The gas diffusion region acts as an intermediary zone between the gas supply region and the exhaust unit. Gas supplied through the gas supply holes diffuses through this intermediate region before reaching the substrate, ensuring uniform distribution and preventing direct exhaust pathways that would create harmful pressure gradients.
2Productivity
If gas supply holes are provided across the entire gas supply part, then gas supply efficiency is improved, but gas consumption increases due to direct exhaust pathways
Solution Approach 1:
By segmenting the gas supply part into gas supply and gas diffusion regions, the system maintains efficient gas supply through targeted hole placement while preventing waste through the diffusion region barrier that blocks direct exhaust pathways, thereby reducing overall gas consumption.
Solution Approach 2:
The gas diffusion region serves as an intermediary that forces gas to take a longer, more efficient path to the substrate and exhaust, preventing short-circuiting through direct exhaust pathways and thereby reducing gas consumption while maintaining deposition efficiency.
3Device complexity
If a simple gas supply structure is used, then device complexity is reduced, but gas distribution uniformity deteriorates
Solution Approach 1:
The gas supply structure is segmented into two functional regions with distinct characteristics: one region for gas supply and another for gas diffusion. This relatively simple segmentation achieves uniform gas distribution without requiring complex control systems or multiple components, balancing structural simplicity with functional effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform deposition of thin layers across the substrate, reduces gas consumption, and enhances the uniformity and efficiency of the deposition process.
Implementation Method 1
a gas diffusion region provided between the gas supply region and the exhaust unit
Data Source
AI summary
A substrate processing system may include a process chamber in which a process on a substrate is performed, a supporting unit in the process chamber to support the substrate, a gas supply unit including a gas supply part with gas supply holes, with the gas supply holes being configured to supply a process gas onto the substrate, and an exhaust unit configured to exhaust the process gas from the process chamber. The gas supply part may include a gas supply region provided with the gas supply holes and a gas diffusion region between the gas supply region and the exhaust unit. The gas diffusion region may be free of the gas supply holes.