Gas-Vented Injection Head for Drip-Free Solder Transfer
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Solution Overview
Problem
In high-density packaging applications, especially for 2.5D or 3D and mobile devices, the small size of solder bumps poses challenges in controlling solder interconnect properties and electro-migration performance, and existing technologies struggle to prevent material dripping during the injection process, which degrades productivity.
Innovation Solution
An injection apparatus with a tank and a head body that includes a slit-like opening part, connected to a second tank with a valve system, allowing gas flow to facilitate smooth material transfer and prevent dripping, even when the opening is covered by a substrate, using either a porous member or holes for gas flow to manage pressure and prevent material loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the opening part is covered by the substrate during material injection, then material can be injected into the substrate, but material drips from the opening part after injection
Solution Approach 1:
The gas flow path is extracted as a separate functional element from the material flow path. Gas channels are provided in the head body that are distinct from the material discharge opening, allowing gas to be introduced to push material back without interfering with the material injection function. This separation enables the opening part to be covered by the substrate while preventing material dripping through gas pressure control.
Solution Approach 2:
Gas acts as an intermediary substance between the material reservoir and the discharge opening. By introducing gas into the head body through separate gas channels, the material is pushed back into the reservoir without direct mechanical intervention. This intermediary gas pressure prevents material from dripping after injection while maintaining the covered opening configuration.
2Loss of substance
If the opening part is kept open to prevent material dripping, then material dripping is avoided, but process productivity decreases due to inability to cover the opening
Solution Approach 1:
The head body is segmented into distinct functional zones: material reservoir, gas channels, and discharge opening. The gas channels are provided as separate pathways within the head body structure, allowing independent control of gas flow and material flow. This segmentation enables the opening to be covered while gas pressure prevents material dripping, thereby maintaining both productivity and material control.
Solution Approach 2:
Pneumatic pressure is applied through gas channels to control material retention and discharge. By introducing gas into the head body, material is pushed back into the reservoir when the opening is covered, preventing dripping. This pneumatic control mechanism allows the opening to remain covered during operation, maintaining productivity while preventing material loss.
3Loss of substance
If gas flow is introduced to push material back, then material dripping is prevented, but device complexity increases
Solution Approach 1:
The gas channels and material discharge opening are merged into a single head body structure. The gas channels are provided within the head body as integrated pathways, combining the material delivery and gas pressure control functions in one component. This integration reduces overall device complexity compared to having separate external gas pressure systems, while still preventing material dripping through gas flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents material dripping during the injection process, maintains high productivity, and allows for efficient transfer of molten solder without solidification, minimizing downtime and ensuring consistent chip package interaction and electro-migration performance.
Implementation Method 1
each of the at least one member includes a porous member that allows the gas to flow therethrough while separating the gas from the material
Implementation Method 2
the at least one member is configured to allow gas to flow into and flow out from the opening part for discharging the material even when the opening part is covered by the substrate
Data Source
AI summary
An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.