Gaseous-Cooled Test Socket Assembly for IC Contact Heat

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Solution Overview

Problem

Conventional test socket assemblies for semiconductor IC chips face challenges in efficiently dissipating the high heat generated during testing, particularly at contact points, leading to degradation and reduced performance and lifespan.

Innovation Solution

The implementation of a socket assembly that utilizes a metallic frame and cartridge with integrated gaseous cooling fluid pathways to dissipate heat effectively, using a manifold assembly with channels for gaseous cooling fluid to circulate around and through the contact points.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional test socket assemblies are used without cooling systems, then the device complexity is low, but the heat generated during testing causes degradation and reduces lifespan

Engineering Contradiction:

Improvelifespan of test socket assemblyVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a gaseous cooling system where a cooling manifold delivers cooled gas through channels in contact with the IC chip and socket assembly. This pneumatic cooling approach effectively removes heat from high-power devices while maintaining a relatively simple structure compared to liquid cooling systems.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The cooling manifold acts as an intermediary component that distributes cooled gas between the cooling source and the heat-generating elements (IC chip and socket assembly). This mediator enables effective heat transfer without requiring direct contact between cooling fluid and electronic components.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If gaseous cooling fluid pathways are integrated into the socket assembly, then heat dissipation efficiency improves, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidintegration complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling manifold is merged with the socket assembly structure, integrating the cooling function into the existing test equipment. The manifold is positioned to utilize existing mounting spaces and structural features, reducing the additional complexity while achieving effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cooling manifold serves multiple functions: it provides structural support for the socket assembly, acts as a heat sink, and distributes cooled gas through integrated channels. This multi-functionality reduces the need for separate cooling components, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If cooling systems are added to dissipate heat at contact points, then the lifespan is extended, but the manufacturing complexity increases

Engineering Contradiction:

Improveperformance consistencyVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The cooling system is segmented into modular components including the cooling manifold, gas delivery channels, and integration points with the socket assembly. This segmentation allows for standardized manufacturing of individual components that can be assembled using conventional techniques, maintaining ease of production while achieving reliable cooling.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach maintains consistent performance and extends the life of the test socket assembly by effectively dissipating heat, reducing maintenance, and minimizing downtime.

Implementation Method 1

a manifold assembly including a manifold defining a channel extending inside the manifold, a manifold inlet coupled with the manifold and sized to receive gaseous cooling fluid

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

The socket assembly defines a fluid path between the manifold inlet and the socket outlet

Methodology Applied

Scientific EffectHeat transfer: Heat Exchanger

Data Source

PatentUS20260043828A1Test socket assemblies cooled with gaseous fluid for semiconductor integrated circuits

Publication Date: 2026.02.12 SMITHS INTERCONNECT AMERICAS INC

AI summary

A socket assembly for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a socket frame including a frame body defining a frame opening sized to receive a chip. The socket assembly also includes a socket cartridge including a cartridge body defining cavities each sized to receive a test probe therein. The socket assembly further includes a manifold assembly including a manifold defining a channel extending inside the manifold, a manifold inlet coupled with the manifold and sized to receive gaseous cooling fluid, and a manifold outlet coupled with the manifold and defining an aperture in fluid communication with the channel and the frame opening. The socket assembly defines a socket outlet in fluid communication with the frame opening, and the socket assembly defines a fluid path between the manifold inlet and the socket outlet.