Large Image Sensor Package With Gasket-Decoupled PCB Assembly
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Solution Overview
Problem
Large format camera systems face challenges in maintaining signal integrity and accommodating thermal expansion differences between components, leading to potential cracking and contamination issues.
Innovation Solution
The image sensor package is designed to mechanically decouple components using gaskets and thermally conductive materials, while strategically placing electronic components closer to the image sensor to improve signal transmission and minimize contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If components are cemented together in the image sensor package, then structural stability is improved, but thermal expansion differences cause cracking and reliability deterioration
Solution Approach 1:
The patent divides the image sensor package into separate movable components (sealing configuration, base, and image sensor) that are not rigidly cemented together. Each component can move independently to accommodate thermal expansion, eliminating the cracking issue while maintaining structural stability through controlled separations and flexible connections.
2Loss of information
If electronic components are placed on the first face of the printed circuit board, then signal transmission is improved, but contamination risk to mating pads increases
Solution Approach 1:
The patent relocates electronic components from the first face (front) of the printed circuit board to the second face (back), utilizing the third dimension (depth/layer) to resolve the contradiction. This spatial reorganization maintains signal transmission quality through optimized trace routing while completely eliminating contamination risk to the mating pads on the first face.
3Length of moving object
If the image sensor is positioned close to the printed circuit board, then signal transmission distance is reduced, but thermal expansion causes misalignment and signal integrity loss
Solution Approach 1:
The patent introduces dynamic movement capability to the image sensor and surrounding printed circuit board, allowing them to expand and contract independently in response to thermal changes. This dynamic adjustment maintains optimal signal transmission distance while compensating for thermal expansion, preventing misalignment and preserving signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages thermal expansion, preserves signal integrity, and reduces the risk of component cracking and contamination, ensuring optimal performance in large format camera systems.
Implementation Method 1
The image sensor package is configured to mechanically decouple various components in the image sensor package (e.g., the image sensor, ceramic base, alumina frame, glass cover, etc.) to accommodate for differing thermal expansion of adjacent and cemented together components during operation
Implementation Method 2
The image sensor package is configured to mechanically decouple various components in the image sensor package (e.g., the image sensor, ceramic base, alumina frame, glass cover, etc.) to accommodate for differing thermal expansion of adjacent and cemented together components during operation
Implementation Method 3
The plurality of wire bonds electrically connect the image sensor to mating pads positioned on the first face of the printed circuit board
Implementation Method 4
the first gasket is a first ball-bearing positioned within a first groove in the frame of the sealing configuration that allows the sealing configuration to be movable while abutting the first face of the printed circuit board
Data Source
AI summary
Disclosed herein is an image sensor package including a printed circuit board, an image sensor electrically coupled to the printed circuit board, a sealing configuration coupled to a front face of the printed circuit board via a first gasket, and a base coupled to a back face of the printed circuit board via a second gasket. Electronic components embedded on the back face of the printed circuit board align with and connect to mating pads surrounding the image sensor on the front face of the printed circuit board. Wire bonds electrically connect the image sensor to the mating pads and the electronic components. The sealing configuration includes a cover attached to a frame surrounding the image sensor. A gap separates the image sensor from abutting the surrounding printed circuit board, which is coupled to the image sensor via the base.