Gate-Around Transistors for Electrostatic Control

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Solution Overview

Problem

The scaling down of transistor gate lengths leads to short-channel effects, such as Drain-Induced Barrier Lowering and degradation of sub-threshold slope, compromising current control and transistor performance.

Innovation Solution

The development of Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) with wrapped-around gates, also known as gate-around transistors, where the gate electrode wraps around all sides of the channel, including the top surface, sidewalls, and underneath the semiconductor strip, enhancing electrostatic control and reducing short-channel effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If gate length is scaled down to increase drive current, then transistor speed increases, but short-channel effects worsen and current control degrades

Engineering Contradiction:
Improvetransistor speedVSAvoidcurrent control
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The gate electrode is extended from a planar configuration into the trench to wrap around the semiconductor strip, transitioning from two-dimensional to three-dimensional control. This allows the gate to control current flow from multiple spatial dimensions (top, sidewalls, and bottom), significantly improving electrostatic control and reducing short-channel effects while maintaining scaled dimensions

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If gate length is scaled down, then drive current increases, but electrostatic control of channel deteriorates

Engineering Contradiction:
Improvedrive currentVSAvoidelectrostatic control
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The gate electrode is nested within the trench structure, wrapping around the semiconductor strip in a nested configuration. The gate dielectric is positioned between the gate electrode and the semiconductor strip, creating a nested arrangement that maximizes the gate's control over the channel while minimizing parasitic capacitance

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS9224849B2Transistors with wrapped-around gates and methods for forming the same
Publication Date: 2015.12.29 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US9224849B2 patent drawing
  • US9224849B2 patent drawing
  • US9224849B2 patent drawing

AI summary

A device includes a substrate, a semiconductor strip over the substrate, a gate dielectric wrapping around the semiconductor strip, and a gate electrode wrapping around the gate dielectric. A dielectric region is overlapped by the semiconductor strip. The semiconductor strip and the dielectric region are spaced apart from each other by a bottom portion of the gate dielectric and a bottom portion of the gate electrode.