Ferroelectric Gate-Coupled Memory Circuit for Lower Leakage

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Solution Overview

Problem

Current memory architectures suffer from large leakage currents, which deteriorate data storage performance in semiconductor memory devices.

Innovation Solution

A memory device comprising a storage transistor, a variable capacitance device, and a control transistor, where the variable capacitance device is electrically connected to the gate of the storage transistor, and the control transistor is connected in series, utilizing a ferroelectric layer for improved storage characteristics, along with specific contact plugs and wires for enhanced connectivity and operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional memory architecture is used, then device simplicity is maintained, but large leakage currents occur deteriorating data storage

Engineering Contradiction:
Improvedata storageVSAvoidleakage currents
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The memory device is segmented into distinct functional components: a storage transistor for data holding, a variable capacitance device for state control, and a control transistor for operation management. This segmentation allows each component to be optimized independently, with the variable capacitance device specifically addressing leakage current issues while the storage transistor maintains data storage function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A variable capacitance device is introduced as an intermediary element between the control transistor and the storage transistor gate. This intermediary component modulates the electric field at the storage transistor gate through capacitance variation, enabling precise control of the storage state while minimizing direct current paths that would cause leakage.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If variable capacitance device is added to reduce leakage, then data storage is improved, but device complexity increases

Engineering Contradiction:
Improvedata storageVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The variable capacitance device serves multiple functions simultaneously: it controls the storage state by modulating gate voltage, it reduces leakage currents through capacitance modulation, and it enables non-volatile storage characteristics. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The control transistor and variable capacitance device are merged into a integrated control structure where the variable capacitance device is electrically connected to the storage transistor gate through the control transistor. This merging allows coordinated operation of control and storage functions within a unified device architecture, reducing the need for separate external control circuits.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces leakage currents, enhancing data storage and improving the signal-to-noise ratio in memory circuits, thereby improving data storage performance.

Implementation Method 1

the variable capacitance layer is a ferroelectric layer

Methodology Applied
Scientific EffectFerroelectricity:

Data Source

PatentUS11764255B2Memory circuit, memory device and operation method thereof
Publication Date: 2023.09.19 ERAYTRONIKS CO LTD
  • US11764255B2 patent drawing
  • US11764255B2 patent drawing
  • US11764255B2 patent drawing

AI summary

The present disclosure provides a memory circuit, a memory device and an operating method of the memory device. The memory device includes a storage transistor, a variable capacitance device and a control transistor. The variable capacitance device is electrically connected to the gate of the storage transistor, and the control transistor is connected to the storage transistor in series.