Gate and Data Line Blocking Layer for Display Light Reflection
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Solution Overview
Problem
Display devices suffer from deterioration in quality due to reflection of external light by metal wires used in the gate and data lines, which affects the image display.
Innovation Solution
Incorporating a blocking layer with specific metals like molybdenum, tungsten, vanadium, niobium, zirconium, tantalum, and oxygen, along with a metal layer of aluminum or copper, to reduce reflection by absorbing or destructively interfering with external light, and using a non-reactive sputtering deposition process to manufacture the metal wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal wires (gate line and data line) are used for excellent electrical conductivity, then electrical conductivity is improved, but external light reflection occurs causing deterioration of display quality
Solution Approach 1:
The patent applies composite materials by combining metal layers (Al, Cu) with blocking layers containing specific metal oxides (Mo, W, V, Nb, Zr, Ta) to create a multi-layer wire structure. This composite structure maintains the electrical conductivity of the metal while the blocking layer with appropriate refractive index and absorption coefficient reduces external light reflection, thus resolving the contradiction between conductivity and display quality.
Solution Approach 2:
The patent applies local quality by creating different layers with specific properties at different locations within the wire structure. The metal layer provides conductivity while the blocking layer with specific composition (3-10 wt% of second metal from V, Nb, Zr, Ta group) and thickness (50-200 nm) provides light absorption and refractive index control at the interface with external light, addressing the reflection problem locally without compromising overall conductivity.
2Object-affected harmful factors
If a blocking layer is added to reduce light reflection, then display quality is improved, but device structure and manufacturing complexity increase
Solution Approach 1:
The patent merges the blocking layer formation with the existing metal layer deposition process by using sequential sputtering with the same target material. The blocking layer is formed by controlling deposition conditions (oxygen partial pressure, power, temperature) during the same manufacturing cycle, combining multiple functions (conductor + optical blocker) into a single integrated structure rather than adding separate components.
Solution Approach 2:
The patent applies parameter changes by controlling the deposition conditions (oxygen partial pressure ratio of 30-70%, power density of 0.5-2.0 W/cm², substrate temperature of 100-300°C) to achieve the desired blocking layer properties. By adjusting these parameters, the refractive index and absorption coefficient are optimized to reduce light reflection without requiring complex additional processing steps.
3Object-affected harmful factors
If multiple metal layers are used to control light reflection, then display quality is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies self-service by using the same target material for depositing both the metal layer and the blocking layer. The target automatically provides the necessary materials in sequence by controlling deposition parameters (oxygen partial pressure, power), eliminating the need for separate targets and complex alignment procedures. The process self-regulates to achieve the desired layer structure with consistent properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes external light reflection, enhancing the display quality by using a blocking layer with high absorption coefficients and appropriate refractive indices, and stabilizing the manufacturing process through precise control of deposition conditions.
Implementation Method 1
the blocking layer includes a first metal from a first group including molybdenum (Mo) and tungsten (W), a second metal from a second group including vanadium (V), niobium (Nb), zirconium (Zr), and tantalum (Ta), and oxygen (O)
Implementation Method 2
a blocking layer that contacts the metal layer, and the blocking layer includes a first metal from a first group including molybdenum (Mo) and tungsten (W), a second metal from a second group including vanadium (V), niobium (Nb), zirconium (Zr), and tantalum (Ta), and oxygen (O)
Implementation Method 3
The deposition process may use non-reactive sputtering
Data Source
AI summary
A display device according to an exemplary embodiment of the present invention includes: a substrate; a gate line and a data line that are provided on the substrate and are insulated from each other; a thin film transistor that is connected with the gate line and the data line; and a pixel electrode that is connected with the thin film transistor, in which at least one of the gate line and the data line includes a metal layer and a blocking layer that contacts the metal layer, and the blocking layer includes a first metal from a first group including molybdenum (Mo) and tungsten (W), a second metal from a second group including vanadium (V), niobium (Nb), zirconium (Zr), and tantalum (Ta), and oxygen (O).