Gate Extension Structure for FEOL Source/Drain Connection

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Solution Overview

Problem

Conventional gate-to-source/drain connections in multi-gate devices require additional lithography steps and space, increasing manufacturing costs and complexity, particularly due to the need for MEOL or BEOL contact structures.

Innovation Solution

An FEOL contact structure is formed by depositing a cladding layer over a fin-shaped structure, allowing self-aligned exposure of source/drain features and direct electrical coupling with a gate electrode, eliminating the need for MEOL or BEOL contact structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional MEOL or BEOL contact structures are used to connect gate and source/drain, then reliable electrical connection is achieved, but manufacturing complexity and cost increase due to additional lithography steps

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The gate electrode is extended into the source/drain region during the front-end-of-line process, before the formation of interlayer dielectric and metal contacts. This preliminary extension creates direct electrical connection between gate and source/drain, eliminating the need for subsequent MEOL/BEOL contact structures and reducing manufacturing complexity while maintaining connection reliability

Inventive Principle:
Principle #10Preliminary action

2Reliability

If butted contacts are used to connect gate and source/drain, then electrical connection is established, but space is consumed in metal line layer affecting routing

Engineering Contradiction:
Improveelectrical connectionVSAvoidmetal line layer space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

Instead of using lateral butted contacts in the metal line layer, the gate electrode is extended vertically into the source/drain region. This dimensional change from lateral to vertical connection eliminates the need for additional metal line layer space, freeing up routing area while maintaining reliable electrical connection

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If additional lithography steps are performed for gate-to-source/drain connection, then precise alignment is achieved, but manufacturing cost increases

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The gate electrode extension structure serves dual purposes: it provides the gate function and simultaneously creates the electrical connection to source/drain. This self-service approach eliminates the need for separate alignment-critical lithography steps for contact formation, reducing manufacturing cost while maintaining precision through the inherent alignment of the extension structure

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS20240292592A1Connection between source/drain and gate
Publication Date: 2024.08.29 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240292592A1 patent drawing
  • US20240292592A1 patent drawing
  • US20240292592A1 patent drawing

AI summary

A semiconductor device according to the present disclosure includes a gate extension structure, a first source/drain feature and a second source/drain feature, a vertical stack of channel members extending between the first source/drain feature and the second source/drain feature along a direction, and a gate structure wrapping around each of the vertical stack of channel members. The gate extension structure is in direct contact with the first source/drain feature.