Gate-Fin Field Effect Transistors for Surface Breakdown Control

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Solution Overview

Problem

Field effect transistors often suffer from surface breakdown voltage due to complex extended low doped drain (LDD) structures, which increase process complexity and cost.

Innovation Solution

A semiconductor structure with a shallow trench isolation structure and a field effect transistor featuring line trenches, a channel region, a gate dielectric contacting all surfaces of the trenches, a gate electrode with planar and fin portions, and source and drain regions laterally spaced by the channel region, along with a method of forming these components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If complex extended low doped drain (LDD) structure is used, then surface breakdown characteristics are improved, but process complexity and cost increase

Engineering Contradiction:
Improvesurface breakdown characteristicsVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the essential function of the complex LDD structure (surface breakdown protection) and implements it through a simpler gate electrode fin structure that protrudes into the trench, eliminating the need for extended LDD regions while maintaining the breakdown voltage characteristics

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of using extended LDD structures to protect the surface, the patent inverts the approach by using a protruding gate electrode fin structure that actively enhances the electric field distribution to improve surface breakdown characteristics, achieving the same protective effect through an opposite structural configuration

Inventive Principle:
Principle #13The other way round (Inversion)

2Reliability

If complex extended low doped drain (LDD) structure is used, then surface breakdown characteristics are improved, but manufacturing cost increases

Engineering Contradiction:
Improvesurface breakdown characteristicsVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the costly extended LDD structure while retaining the essential surface breakdown protection function through a simpler gate electrode fin design, reducing manufacturing steps and material usage

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the expensive and complex extended LDD structure with a more economical gate electrode fin structure that achieves the same protective function, effectively using a simpler, cheaper alternative to accomplish the required reliability

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS11967626B2Field effect transistors with gate fins and method of making the same
Publication Date: 2024.04.23 SANDISK TECHNOLOGIES LLC
  • US11967626B2 patent drawing
  • US11967626B2 patent drawing
  • US11967626B2 patent drawing

AI summary

A field effect transistor includes at least one line trench extending downward from a top surface of a channel region which laterally surrounds or underlies the at least one line trench, a gate dielectric contacting all surfaces of the at least one line trench and including a planar gate dielectric portion that extends over an entirety of a top surface of the channel region, a gate electrode, a source region, and a drain region.