Gate-First Dopant Implantation for Spin Qubit Placement

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Solution Overview

Problem

Current methods for fabricating donor-based spin qubits face challenges in precise and deterministic placement of single atoms within semiconductor host materials, limiting scalability and integration in wafer-scale manufacturing, particularly in achieving long coherence times and efficient quantum circuit assembly.

Innovation Solution

The gate-first method involves providing gate electrodes over a semiconductor substrate with a window structure to create a defined path for dopant atom implantation, using carefully tuned ion implant fluence and kinetic energy to achieve precise placement and integration of dopant-based spin qubits on a wafer scale.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional fabrication methods are used for donor-based spin qubits, then manufacturing process is simpler, but precise and deterministic placement of single atoms is not achieved

Engineering Contradiction:
Improveplacement precision of dopant atomsVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The gate structure is formed prior to dopant atom implantation, creating a predefined pathway that guides atoms to their intended locations. This preliminary structural preparation enables deterministic placement without requiring complex post-implantation manipulation procedures

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The gate structure serves as an intermediary element that mediates between the dopant source and the semiconductor substrate. It provides a controlled interface that directs atom flow and ensures precise positioning during the implantation process

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If wafer-scale integration is implemented, then productivity increases, but maintaining long coherence times becomes more difficult

Engineering Contradiction:
Improveproduction scalability of spin qubitsVSAvoidcoherence time of qubits
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The wafer is divided into multiple independent qubit sites, each with its own gate structure and dopant atom. This segmentation allows parallel fabrication of many qubits while maintaining isolated quantum environments that preserve coherence times

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The implantation fluence is carefully controlled and optimized to achieve single-atom placement with high precision. By adjusting this critical parameter, the method enables scalable production while maintaining the quantum coherence required for functional qubits

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If ion implantation is used for dopant atom placement, then manufacturing precision improves, but control over single atom placement becomes challenging

Engineering Contradiction:
Improveplacement precision of dopant atomsVSAvoidcontrol difficulty of implantation process
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The gate structure creates a localized region with distinct properties that differ from the surrounding area. This local structural quality enhancement provides a preferential pathway for dopant atoms, enabling precise placement without requiring complex global control mechanisms

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables scalable production of dopant-based spin qubit devices with improved coherence times and deterministic placement, facilitating wafer-scale integration and enhanced performance in quantum computing applications.

Implementation Method 1

using carefully tuned ion implant fluence and kinetic energy to achieve precise placement and integration of dopant-based spin qubits on a wafer scale

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Data Source

PatentUS11355623B2Wafer-scale integration of dopant atoms for donor- or acceptor-based spin qubits
Publication Date: 2022.06.07 INTEL CORP
  • US11355623B2 patent drawing
  • US11355623B2 patent drawing
  • US11355623B2 patent drawing

AI summary

Embodiments of the present disclosure describe a method of fabricating spin qubit device assemblies that utilize dopant-based spin qubits, i.e. spin qubit devices which operate by including a donor or an acceptor dopant atom in a semiconductor host layer. The method includes, first, providing a pair of gate electrodes over a semiconductor host layer, and then providing a window structure between the first and second gate electrodes, the window structure being a continuous solid material extending between the first and second electrodes and covering the semiconductor host layer except for an opening through which a dopant atom is to be implanted in the semiconductor host layer. By using a defined gate-first process, the method may address the scalability challenges and create a deterministic path for fabricating dopant-based spin qubits in desired locations, promoting wafer-scale integration of dopant-based spin qubit devices for use in quantum computing devices.