Gate Insulating Layer Acute Angle Design for Display Bending Area
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Solution Overview
Problem
In display apparatuses, conductive materials often unintentionally remain around the bending area after the removal of an inorganic layer, leading to defects due to stress-induced cracks.
Innovation Solution
A display apparatus design featuring a substrate with a buffer layer, semiconductor layers, and strategically formed gate insulating layers with specific acute angles and openings to minimize conductive material residue, including a method of manufacturing that involves forming openings and through-holes with controlled angles to reduce stress and prevent material accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inorganic layer is removed from the bending area to prevent stress-induced cracks, then the reliability of the display apparatus is improved, but conductive material may unintentionally remain around the removed region causing defects
Solution Approach 1:
The gate insulating layer is formed with a predetermined acute angle (greater than or equal to 45 degrees) before the inorganic layer removal process. This preliminary angular configuration prevents conductive material from adhering to vertical surfaces during subsequent manufacturing steps, eliminating the harmful residue issue before it can occur.
Solution Approach 2:
The inner surface angle of the gate insulating layer is changed from a conventional vertical or shallow angle to a specific acute angle range (45 degrees or more). This parameter modification alters the surface morphology to prevent conductive material accumulation while maintaining the structural integrity needed for stress resistance in the bending area.
2Manufacturing precision
If openings and through-holes are formed with controlled acute angles to prevent conductive material accumulation, then manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The acute angle configuration is applied specifically to the gate insulating layer regions where openings and through-holes are formed, rather than uniformly across the entire device. This localized application achieves the desired manufacturing precision for conductive material control without unnecessarily complicating other parts of the display apparatus structure.
Solution Approach 2:
The gate insulating layer is designed with asymmetric angular characteristics - featuring acute angles of 45 degrees or more on specific inner surfaces while maintaining different configurations on other surfaces. This asymmetric design enables precise control of conductive material deposition patterns without requiring complete structural redesign.
Data Source
AI summary
A display apparatus includes a substrate including a component area including a transmission area, a main area outside the component area, and a bending area bent based on a bending axis, a buffer layer disposed on the substrate, a first semiconductor layer disposed on the buffer layer, and a first gate insulating layer overlapping the first semiconductor layer and including a 1-1st opening corresponding to the bending area, and a 1-1st through-hole exposing a portion of the first semiconductor layer. A first acute angle formed by an inner surface of the 1-1st opening with respect to an upper surface of the substrate is less than a first contact acute angle formed by an inner surface of the 1-1st through-hole with respect to the upper surface of the substrate.