Injection Mold Gate Mark Receiving Portion for Resin Housing
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Solution Overview
Problem
The challenge is to produce electronic device housings with high rigidity reinforcing materials using a hot runner type injection mold without generating scraps, which is essential for reducing production costs and preventing resin flow issues during injection.
Innovation Solution
The solution involves forming a housing with a side member that includes a gate mark receiving portion on its side surfaces, processed inside the injection mold, allowing for smooth assembly and eliminating scrap generation by using a hot runner mold, even with high content rigidity reinforcing materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a cold runner mold is used to inject resin with high content of rigidity reinforcing material, then scrap is generated after injection, but if a hot runner mold is used, resin flows unintentionally from the nozzle before injection
Solution Approach 1:
The patent changes the temperature parameter of the runner system by using a hot runner mold instead of a cold runner mold. This maintains the resin in a molten state throughout the runner, preventing premature solidification and unwanted flow, while allowing complete utilization of the injected resin without scrap generation.
Solution Approach 2:
The patent introduces a gate mark receiving portion as an intermediary structure that captures and contains any residual resin flow at the gate area. This mediator structure prevents unwanted resin flow from affecting the final product quality while working in conjunction with the hot runner system.
2Strength
If a high content of rigidity reinforcing material is added to the resin, then the mechanical rigidity of the housing is improved, but the resin flows unintentionally from the nozzle before injection
Solution Approach 1:
The patent changes the temperature parameter by implementing a hot runner mold system, which maintains the resin with rigidity reinforcing materials in a controlled molten state. This prevents premature solidification and unwanted flow, while preserving the rigidity-enhancing properties of the reinforcing materials in the final housing.
Solution Approach 2:
The gate mark receiving portion serves as an intermediary structure that captures any residual resin flow containing rigidity reinforcing materials. This ensures that the flow control issue is resolved without compromising the mechanical rigidity provided by the reinforcing materials in the main housing structure.
3Ease of manufacture
If a hot runner mold is used to inject resin with rigidity reinforcing material, then production cost is reduced by eliminating scraps, but resin flows unintentionally from the nozzle before injection
Solution Approach 1:
The patent implements a hot runner mold system that maintains resin in a controlled molten state, eliminating scrap generation and reducing production costs. The temperature parameter is optimized to prevent unwanted flow while enabling complete utilization of the injected resin.
Solution Approach 2:
The gate mark receiving portion acts as an intermediary structure that captures any residual resin flow, ensuring that the hot runner system operates reliably without causing defects. This mediator structure enables cost-effective production by eliminating scrap while maintaining product quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of electronic devices with reduced production costs and improved mechanical rigidity, preventing resin flow issues and ensuring efficient assembly by using a hot runner type injection mold with a gate mark receiving groove or rib.
Implementation Method 1
a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing in a direction opposite to that of the first plate, and a side member enclosing a space between the first plate and the second plate and formed with a method of solidifying a resin including a predetermined amount of rigidity reinforcing material injected into an injection mold and including a plurality of side surfaces, and a gate mark receiving portion formed in each of the plurality of side surfaces of the side member and configured to receive at least one gate mark according to separation of the injection mold. The gate mark receiving portion is formed by a processing portion disposed at a corresponding position inside a cavity of the injection mold.