Multi-Pass GCIB Substrate Correction via Segmented Beam Resolution
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Solution Overview
Problem
Existing gas cluster ion beam (GCIB) processing technologies face challenges in achieving location-specific and uniform processing of substrates due to non-uniformities and spatial gradients, which can lead to inconsistent results and reduced yield in semiconductor and other industrial applications.
Innovation Solution
A method and system that utilize metrology data to compute correction data for adjusting substrate regions, employing GCIBs with varying beam resolutions to address spatial gradients, allowing for precise location-specific processing by selecting appropriate beam properties such as cross-sectional dimension and edge profile through a multi-process controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single beam resolution is used for GCIB processing, then the processing is simpler and faster, but the uniformity and precision across different substrate regions deteriorates due to spatial gradients
Solution Approach 1:
The substrate surface is divided into multiple regions based on spatial gradient characteristics (high gradient regions vs. low gradient regions). Different beam resolutions are applied to different regions: finer beam resolution for high gradient regions requiring precise control, and coarser beam resolution for low gradient regions where uniform processing is sufficient. This segmentation allows the system to achieve overall processing uniformity without applying the most complex fine-resolution processing everywhere.
Solution Approach 2:
The patent implements location-specific processing by tailoring beam properties (resolution, cross-sectional dimension, edge profile) to the local characteristics of each substrate region. High gradient regions receive beams with properties optimized for precision and control, while low gradient regions receive beams optimized for efficiency and uniformity. This local quality approach ensures each region receives the appropriate processing quality without unnecessary complexity elsewhere.
2Manufacturing precision
If a fine beam resolution is used across the entire substrate, then processing precision is improved, but processing time and productivity deteriorate
Solution Approach 1:
The substrate is segmented into high gradient regions requiring fine beam resolution and low gradient regions where coarse beam resolution suffices. By processing only the necessary regions with fine resolution, the system achieves location-specific precision without subjecting the entire substrate to time-consuming fine-resolution processing, thereby maintaining high productivity.
Solution Approach 2:
Instead of applying fine beam resolution excessively across the entire substrate, the patent applies fine resolution partially only where spatial gradients demand it. This partial action approach avoids the productivity penalty of universal fine-resolution processing while still achieving the necessary precision in critical regions.
3Manufacturing precision
If beam cross-sectional dimension is reduced for high gradient regions, then processing precision is improved, but energy consumption and processing time increase
Solution Approach 1:
The patent adjusts beam cross-sectional dimension locally according to regional requirements: smaller cross-sections are used only in high gradient regions where precision is critical, while larger cross-sections are used in low gradient regions where efficiency matters more. This local optimization reduces overall energy consumption compared to using small cross-sections everywhere, while still achieving necessary precision in gradient regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables enhanced substrate processing by correcting non-uniformities and creating intended variations, improving yield and process repeatability by applying GCIBs with tailored resolutions to match spatial gradients, resulting in more consistent and efficient surface modifications.
Implementation Method 1
Gas-cluster ion beams (GCIB's) are used for etching, cleaning, smoothing, and forming thin films
Implementation Method 2
The ion clusters disintegrate on impact with the workpiece. Each individual molecule in a particular disintegrated ion cluster carries only a small fraction of the total cluster energy
Implementation Method 3
The gas clusters can be ionized by electron bombardment, which permits the gas clusters to be formed into directed beams of controllable energy
Implementation Method 4
Clusters of atoms can be formed by the condensation of individual gas atoms (or molecules) during the adiabatic expansion of high pressure gas from a nozzle into a vacuum
Implementation Method 5
A skimmer with a small aperture strips divergent streams from the core of this expanding gas flow to produce a collimated beam of clusters
Data Source
AI summary
A method and system of location specific processing on a substrate is described. The method comprises acquiring metrology data for a substrate, and computing correction data for adjusting a first region of the metrology data on the substrate. Thereafter, a first gas cluster ion beam (GCIB) for treating the high gradient regions is established, and the first GCIB is applied to the substrate according to the correction data. The method further comprises optionally acquiring second metrology data following the applying of the first GCIB, and computing second correction data for adjusting a second region of the metrology data, or the second metrology data, or both on the substrate. Thereafter, a second gas cluster ion beam (GCIB) for treating the second region is established, and the second GCIB is applied to the substrate according to the second correction data.