Gas Cluster Ion Beam Substrate Processing Throughput

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Solution Overview

Problem

Conventional gas cluster ion beam processing systems face challenges in achieving location-specific processing of substrates with non-uniformities, leading to variations in geometrical, mechanical, and optical parameters, which affects the yield and consistency of semiconductor devices.

Innovation Solution

A method and system utilizing a gas cluster ion beam (GCIB) processing system that acquires metrology data, computes correction data for each substrate, and applies it using a GCIB to correct non-uniformities and create specific variations, incorporating a multi-process controller to manage the GCIB processing system and metrology data.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional ion beam processing is used, then deep subsurface damage occurs, but location-specific processing with high precision is difficult to achieve

Engineering Contradiction:

Improvelocation-specific processing precisionVSAvoidsubsurface damage

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent changes the fundamental parameter of ion beam processing by using gas cluster ion beams instead of conventional ion beams. The cluster ions disintegrate on impact, distributing energy across multiple molecules and limiting damage to a very shallow surface region while enabling precise location-specific processing through controlled beam delivery

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The system implements location-specific processing by controlling the GCIB to treat only predetermined regions of the substrate. The method involves measuring metrology data, computing correction data for specific locations, and applying GCIB processing only to those targeted areas, thereby achieving high precision without affecting other regions

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If correction data is computed for all substrates before processing, then processing precision is improved, but processing time increases significantly

Engineering Contradiction:

Improvecorrection data accuracyVSAvoidsubstrate processing throughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The system performs preliminary computation of correction data for multiple substrates based on metrology data acquired beforehand. This allows the control system to have correction strategies ready for all substrates in advance, enabling rapid sequential processing without real-time computation delays

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The method maintains continuous processing by computing correction data for subsequent substrates while simultaneously applying corrections to current substrates. This overlapping of computation and processing activities eliminates idle time and maintains continuous productive action throughout the batch processing sequence

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the yield and consistency of semiconductor devices by correcting non-uniformities and creating intended variations, providing a more repeatable and efficient processing system for substrates.

Implementation Method 1

The gas clusters can be ionized by electron bombardment, which permits the gas clusters to be formed into directed beams of controllable energy

Methodology Applied

Scientific EffectElectron bombardment ionization: Photoionisation

Implementation Method 2

Clusters of atoms can be formed by the condensation of individual gas atoms (or molecules) during the adiabatic expansion of high pressure gas from a nozzle into a vacuum

Methodology Applied

Scientific EffectAdiabatic expansion condensation: Adiabatic Cooling

Implementation Method 3

The ion clusters disintegrate on impact with the workpiece. Each individual molecule in a particular disintegrated ion cluster carries only a small fraction of the total cluster energy

Methodology Applied

Scientific EffectImpact disintegration: Impact Force

Data Source

PatentUS7917241B2Method and system for increasing throughput during location specific processing of a plurality of substrates

Publication Date: 2011.03.29 美国泰尔制造与工程公司

AI summary

A method and system of location specific processing on a plurality of substrates is described. The method comprises measuring metrology data for the plurality of substrates. Thereafter, the method comprises computing correction data for a first substrate using the metrology data, followed by computing correction data for a second substrate using the metrology data. While computing the correction data for a second substrate, the method comprises applying the correction data for a first substrate to the first substrate using a gas cluster ion beam (GCIB).