GCSE Comb Laser Thermal Structure to Prevent Chip Deformation
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Solution Overview
Problem
Conventional thermal management approaches for grating-coupled surface-emitting (GCSE) comb lasers, such as attaching heat sinks directly to the chip, risk damaging or deforming the thin laser chips due to mechanical force, which is not suitable for dense wavelength division multiplexing (DWDM) systems requiring efficient heat dissipation without chip deformation.
Innovation Solution
The integration of a heat sink positioned above the GCSE laser chip with support bars and thermal interface material, allowing heat dissipation without direct contact, thereby avoiding mechanical force and enabling efficient thermal management while maintaining chip integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are attached directly to the laser chip, then thermal dissipation efficiency is improved, but the thin laser chip may be damaged or deformed due to mechanical force
Solution Approach 1:
The patent introduces an intermediary structure (support bar with thermal interface material) between the heat sink and the laser chip. This intermediary transfers heat from the chip to the heat sink while mechanically isolating the chip from the heat sink's weight and mounting forces, thus resolving the contradiction between thermal dissipation efficiency and chip integrity
Solution Approach 2:
The thermal management system is segmented into distinct functional components: the laser chip, support bars for mechanical support, thermal interface material for heat transfer, and heat sink for thermal dissipation. This segmentation allows each component to be optimized independently, enabling efficient heat transfer without direct mechanical contact between the heat sink and chip
2Ease of manufacture
If standard packaging procedures are used, then manufacturing simplicity is maintained, but thermal management effectiveness may be insufficient for high-power laser operations
Solution Approach 1:
The patent merges mechanical support functions and thermal management functions into a unified packaging structure. The support bars serve both mechanical support and thermal conduction purposes, while the heat sink integrates both thermal dissipation and structural stabilization functions, maintaining manufacturing simplicity while improving thermal management effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages thermal dissipation in GCSE comb lasers, preventing chip deformation and damage, while maintaining compatibility with standard packaging procedures, thus ensuring stable operation and scalability for DWDM systems.
Implementation Method 1
thermal interface material, allowing heat dissipation without direct contact
Implementation Method 2
integration of a heat sink positioned above the GCSE laser chip with support bars and thermal interface material, allowing heat dissipation
Data Source
AI summary
Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.