Gel-Filled Electronic Package Without Custom Mold Tooling
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Solution Overview
Problem
Conventional SMD power package packaging techniques require a new mold tool for each unique package geometry, leading to high costs due to the need for expensive reusable mold tools.
Innovation Solution
An electronic device package is designed with a frame and filled with a gel, where the electronic device is mounted to the frame with a gel covering the circuitry, and surface-mount leads extend outwardly, using a frame base and lid with optional multiple components, and a gel that partially or fully fills the cavity between the device and frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If transfer molding with custom mold tools is used for each unique package geometry, then manufacturing precision and package protection are improved, but device complexity and production cost increase
Solution Approach 1:
The patent replaces expensive, custom-made reusable mold tools with inexpensive, disposable gel materials that can be easily applied and removed. The gel serves as a temporary packaging medium that is discarded after use, eliminating the need for costly mold tool fabrication and maintenance for each unique package geometry.
Solution Approach 2:
The patent changes the physical state and properties of the packaging material from rigid mold tools to flexible gel materials. The gel can be applied in liquid or semi-liquid form and then cured to provide the necessary structural support, allowing for easy adaptation to different package geometries without requiring new tooling.
2Reliability
If transfer molding with custom mold tools is used for each unique package geometry, then package protection is improved, but production cost increases
Solution Approach 1:
The patent replaces expensive, custom-made reusable mold tools with inexpensive, disposable gel materials that can be easily applied and removed. The gel serves as a temporary packaging medium that is discarded after use, eliminating the need for costly mold tool fabrication and maintenance for each unique package geometry.
Solution Approach 2:
The gel material can be molded to replicate the exact geometry of the electronic device, creating a custom-fit protective package without requiring expensive tooling. The gel takes the shape of the device cavity, providing tailored protection while using inexpensive materials.
3Ease of manufacture
If gel is used to fill the cavity instead of mold tools, then ease of manufacture and adaptability are improved, but manufacturing precision may worsen
Solution Approach 1:
The patent changes the physical state and properties of the packaging material from rigid mold tools to flexible gel materials. The gel can be applied in liquid or semi-liquid form and then cured to provide the necessary structural support, allowing for easy adaptation to different package geometries without requiring new tooling.
Solution Approach 2:
The gel material is applied to the device cavity in a fluid state, allowing it to flow and conform to the exact geometry of the cavity. Once cured, the gel maintains its shape and provides precise packaging, combining the ease of fluid application with the precision of a custom-fit solid structure.
Data Source
AI summary
An electronic device package includes a frame, an electronic device mounted to the frame, surface-mount leads, and a gel at least partially filling a cavity between the electronic device and the frame. The electronic device includes electronic circuitry provided on an electronic device substrate, and the surface-mount leads are electrically connected to the electronic circuitry and extend laterally and outwardly from an outer perimeter of the frame. The gel in the cavity covers the electronic circuitry.