Gel-Filled Power Module Circuit Carrier for Crack-Resistant Packaging
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Solution Overview
Problem
Existing power modules enclosed in molding compounds are prone to cracking due to insufficient resistance to mechanical stress and thermal expansion, leading to potential failure and reduced reliability.
Innovation Solution
The power module is filled with a silicone gel material instead of a molding compound, and spacers are used to ensure proper alignment and heat dissipation, with sintered connections to distribute stress evenly and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power modules are enclosed in molding compound, then protection and enclosure are provided, but resistance to cracks and mechanical stress is insufficient
Solution Approach 1:
The patent changes the physical state and mechanical properties of the enclosing material from rigid molding compound to flexible gel material. This parameter change allows the material to deform elastically under stress, absorbing mechanical shocks and thermal expansion forces without cracking, thereby simultaneously improving both reliability and strength
Solution Approach 2:
The patent uses a composite structure combining gel material with protective housing and cover. The gel material provides flexibility and stress absorption, while the housing and cover provide structural protection. This composite approach resolves the contradiction by combining materials with complementary properties to achieve both crack resistance and mechanical strength
2Reliability
If gel material is used instead of molding compound, then elasticity and flexibility improve to absorb thermal stresses, but structural rigidity may be reduced
Solution Approach 1:
The patent changes the material parameter from rigid to flexible by using gel material, which enables elastic deformation to absorb thermal stresses. The gel's viscoelastic properties allow it to maintain structural integrity while accommodating thermal expansion and contraction, resolving the contradiction between flexibility for stress absorption and rigidity for structural support
3Manufacturing precision
If spacers are introduced for alignment and heat dissipation, then manufacturing precision and thermal management improve, but device complexity increases
Solution Approach 1:
The spacers in the patent serve multiple functions simultaneously: they provide mechanical alignment between components, maintain proper spacing for heat dissipation, and act as structural support elements. This multi-functionality allows the spacers to improve manufacturing precision and thermal management without proportionally increasing device complexity, as a single component type accomplishes multiple tasks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicone gel provides elasticity and flexibility to absorb thermal stresses, improving insulation and reducing cracking, while sintered connections enhance structural integrity and heat dissipation, leading to improved performance and reliability.
Implementation Method 1
The silicone gel provides elasticity and flexibility to absorb thermal stresses
Implementation Method 2
sintered connections enhance structural integrity and heat dissipation
Data Source
AI summary
A power module with a circuit carrier. The power module includes a carrier substrate and an electrical insulation layer. The circuit carrier includes a first conductor structure with an external contact region and at least one second conductor structure with at least one external contact region and a further, third conductor structure, which includes at least one external contact region, having semiconductor components. A multifunctional frame and a frame are assigned to the power module. Groups of semiconductor components are arranged in a first plane spatially separated from a second plane in the multifunctional frame. The semiconductor components are electrically connected to one another by a first sintered connection with at least one first spacer or by a bonded connection with at least one bond wire. The second plane is at least partially enclosed laterally by the frame and is filled with a gel material.