Continuous Gel Interconnects Across Rigid-Flexible Material Junctions
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Solution Overview
Problem
Existing technologies face challenges in creating effective interconnects between heterogeneous materials, particularly in deformable electronic assemblies where hard and soft materials need to be seamlessly connected, often requiring complex engineering and design constraints.
Innovation Solution
The use of continuous interconnects formed by conductive gels or other functional materials through vias or passages in mixed material substrates, allowing for direct printing on substrates or arrangement in various manners to create mechanical and electrical connections across heterogeneous junctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional solid wire interconnects are used between heterogeneous materials, then electrical connection is achieved, but the structure cannot tolerate dynamic loading and deformation
Solution Approach 1:
The patent changes the physical state of the interconnect material from solid to gel phase. The conductive gel maintains electrical conductivity while possessing soft, deformable properties that allow it to tolerate strain and dynamic loading between rigid and flexible substrates without breaking the electrical connection
Solution Approach 2:
The patent uses composite material structures where conductive gel is combined with encapsulants and interface materials. The conductive gel itself may be a composite containing conductive particles or fillers within a gel matrix, providing both electrical conductivity and mechanical flexibility
2Reliability
If complex engineering and design constraints are applied to connect hard and soft materials, then interconnect reliability is improved, but device complexity increases
Solution Approach 1:
The conductive gel acts as an intermediary material between hard and soft substrates. This single material simultaneously provides electrical conductivity, mechanical compliance, and strain tolerance, eliminating the need for complex multi-layer interconnect structures, transition pieces, or specialized bonding mechanisms
Solution Approach 2:
By changing the material parameter from solid to gel phase, the patent achieves both electrical functionality and mechanical compliance in a single material, simplifying the overall device architecture while maintaining reliable electrical connections across heterogeneous interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables robust, strain-resistant electrical connections that can tolerate dynamic loading and deformation, facilitating the integration of rigid and flexible components in deformable electronic devices without the need for solid wires.
Implementation Method 1
a conductive gel arranged in a pattern on the second substrate and forming a continuous electrical interconnect with the conductive contact layer
Data Source
AI summary
A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.