Gel Substrate Support for Vacuum Wafer Contact Protection
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Solution Overview
Problem
Substrates such as semiconductor wafers are prone to damage and particle generation during transfer and processing due to physical contact, leading to issues like surface flatness loss and focal shift in exposure processes.
Innovation Solution
Incorporating a gel member made of a gel holding a solvent by a polymer network, specifically using an ionic liquid, at contact points with the substrate to act as a cushion and prevent physical contact, which is resistant to solvent volatilization even in vacuum environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If physical contact is used to support and transfer substrates, then mechanical strength and structural simplicity are improved, but substrate damage and particle generation occur
Solution Approach 1:
A gel member is introduced as an intermediary between the support surface and the substrate. This gel member contacts the substrate instead of rigid support surfaces, preventing direct physical contact that causes damage while still providing necessary mechanical support through the gel's structural properties
Solution Approach 2:
The support surface transitions from a rigid state to a gel state by changing material parameters. The gel member has different physical properties than traditional rigid supports, combining mechanical strength with surface softness to prevent substrate damage during contact
2Device complexity
If conventional solid support surfaces are used, then structural simplicity is improved, but surface flatness loss and particle generation occur
Solution Approach 1:
The support surface material parameter is changed from solid to gel state. This parameter change allows the surface to conform to substrate irregularities and maintain flatness without requiring complex precision engineering of the underlying support structure
3Ease of manufacture
If volatile solvents are used in gel members, then gel formation is improved, but solvent volatilization in vacuum environments occurs
Solution Approach 1:
The solvent parameter is changed from volatile to non-volatile. Ionic liquids are used instead of conventional volatile solvents, maintaining the gel's formation and structural properties while eliminating volatilization issues in vacuum environments through their inherently low vapor pressure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate damage and particle generation, maintaining the integrity of the substrate during processing while maintaining a reduced-pressure environment.
Implementation Method 1
The gel member is made of a gel holding a solvent by a polymer network
Implementation Method 2
specifically using an ionic liquid, at contact points with the substrate to act as a cushion and prevent physical contact, which is resistant to solvent volatilization even in vacuum environments
Data Source
AI summary
A substrate support includes a support and a gel member. The support is for supporting a substrate. The gel member is provided at a location of the support in contact with the substrate and is made of a gel holding a solvent by a polymer network.