Gel-Type Thermal Interface Material Composition for Low-Leakage Flow
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Solution Overview
Problem
Traditional thermal interface materials face challenges in meeting small thickness requirements, automated production, and oil leakage (bleeding) issues, particularly in gel products with good flow properties.
Innovation Solution
A thermal interface material comprising low and high molecular weight silicone oils, thermally conductive fillers with varying surface areas, solvents, inhibitors, and crosslinkers, which reduces oil leakage while maintaining flow rate and thickness control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If gel-type thermal interface materials with good flow properties are used, then automated production and thickness control are improved, but oil leakage (bleeding) increases
Solution Approach 1:
The patent modifies the chemical composition parameters of the silicone oil, specifically using a silicone oil with a molecular weight of 10,000-50,000 and a viscosity of 100-10,000 cSt at 25°C. This parameter optimization allows the material to maintain adequate flow properties for automated dispensing while reducing oil leakage, resolving the contradiction between productivity and harmful factors.
Solution Approach 2:
The patent creates a composite thermal interface material by combining thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) with the optimized silicone oil matrix. This composite structure improves thermal conductivity while the optimized matrix prevents oil leakage, simultaneously addressing productivity requirements and eliminating harmful effects.
2Temperature
If thermally conductive fillers with large surface area are used, then thermal conductivity is improved, but viscosity increases reducing flow rate
Solution Approach 1:
The patent optimizes the particle size parameters of the thermally conductive fillers, specifying an average particle size of 1-50 micrometers. This parameter control allows the fillers to provide adequate thermal conductivity while maintaining a flow rate of at least 10 mL/min, resolving the contradiction between thermal performance and flow speed.
Solution Approach 2:
The patent uses a distribution of filler particle sizes within the specified range, creating local variations in the material structure. Smaller particles fill gaps between larger particles, improving thermal conductivity pathways without excessively increasing viscosity, thus maintaining adequate flow rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material effectively transfers heat with reduced oil leakage and improved flow characteristics, suitable for automated production and precise thickness application.
Implementation Method 1
at least one thermally conductive filler having a relatively large surface area
Implementation Method 2
Gel-type thermal interface material
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers