Gold Finger PCIe SAS Gen5 Connector Structure for Impedance Control
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Solution Overview
Problem
Current electrical connectors face challenges in maintaining high-speed and high-performance signal transmission due to impedance variations and crosstalk, particularly in high-frequency applications like PCIe and SAS standards, where mechanical strength and signal integrity are critical.
Innovation Solution
The design incorporates conductive elements with thicker and thinner portions, where the thinner portions are closer to the mating end, and the housing features voids and platforms to reduce impedance variations and mechanical stress, ensuring stable contact and improved signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connectors are used for high-speed signal transmission, then mechanical strength is maintained, but impedance variations and crosstalk increase at high frequencies
Solution Approach 1:
The conductive elements feature varying thickness profiles with thicker portions and thinner portions at different locations. The thinner portions are positioned closer to the mating end to reduce impedance variations and crosstalk at critical signal transmission zones, while the thicker portions provide mechanical strength and durability where needed
Solution Approach 2:
The conductive elements are divided into distinct functional portions: thicker portions for mechanical support and thinner portions for optimized signal transmission. This segmentation allows each portion to be optimized for its specific function, resolving the contradiction between mechanical strength and signal integrity
2Ease of manufacture
If uniform thickness conductive elements are used, then manufacturing is simpler, but signal transmission quality deteriorates at high frequencies
Solution Approach 1:
The conductive elements incorporate non-uniform thickness with thicker and thinner portions at different locations. This local variation optimizes signal transmission quality at high frequencies by reducing impedance variations and crosstalk, while still maintaining manufacturability through established forming processes
3Strength
If thicker conductive elements are used throughout, then mechanical strength is improved, but impedance control and signal integrity worsen at high frequencies
Solution Approach 1:
The conductive elements feature thicker portions positioned away from the mating end to provide mechanical strength and durability, while thinner portions are positioned closer to the mating end to optimize impedance control and reduce crosstalk for high-frequency signal transmission
Solution Approach 2:
The conductive elements are segmented into thicker portions for mechanical support and thinner portions for optimized electrical performance. This segmentation resolves the contradiction by allowing each portion to be optimized for its primary function
Data Source
AI summary
A connector for use with high-speed signals. The connector has a housing, which includes conductive elements held in a row by a housing. Each conductive element includes a thinner portion and a thicker portion. The conductive elements are configured to make contact with a mating component at the thicker portions. The thinner portions are closer to mating ends of respective conductive elements than respective thicker portions. The housing is configured to provide voids selectively disposed underneath the conductive elements. Such a configuration increases impedances for the conductive elements at locations that would otherwise have lower impedance and therefore reduces impedance variations along signal transmission paths. Such a configuration can also reduce stub size and therefore reduce insertion loss. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.