Gene Chip Substrate Accommodation Region for Bubble Management

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current gene chip packaging technologies face limitations in flatness and sealing degree due to air bubbles and uneven force distribution, which affect the accuracy and yield of gene sequencing results.

Innovation Solution

A bio-information detection substrate with a test region and a dummy region featuring an accommodation region, such as a groove, that allows air bubbles in the sealant layer to enter and be absorbed, preventing channel formation and ensuring even force distribution during cell-assembling, thereby improving packaging yield and flatness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If current packaging mode is used for gene chip, then production process is simple, but flatness and sealing degree are insufficient

Engineering Contradiction:
Improveflatness and sealing degreeVSAvoidsubstrate structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate pre-forms accommodation regions (grooves) in advance before packaging. These grooves are prepared in the dummy region to receive and accommodate air bubbles that may form during the sealant application process, preventing them from affecting the final packaging quality.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Instead of trying to completely prevent air bubble formation during packaging, the invention converts the harmful air bubbles into a beneficial element by providing dedicated accommodation regions. The air bubbles are redirected to serve as space-fillers in the dummy region, eliminating their harmful effect while maintaining packaging simplicity.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Manufacturing precision

If air bubbles are present in sealant layer during cell-assembling, then packaging process is simple, but sealing degree and flatness deteriorate

Engineering Contradiction:
Improvesealing degreeVSAvoidpackaging process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The invention extracts the air bubbles from the critical test region and sealant layer by providing dedicated accommodation regions in the dummy region. The air bubbles are taken out of the harmful context (sealant layer) and placed in a harmless context (accommodation region), ensuring proper sealing without complicating the packaging process.

Inventive Principle:
Principle #2Taking out (Extraction)

3Measurement precision

If air bubbles form channels in sealant layer, then packaging is easier, but gene sequencing accuracy decreases

Engineering Contradiction:
Improvegene sequencing accuracyVSAvoidsubstrate structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The substrate structure preliminarily counteracts the harmful effect of air bubbles by providing accommodation regions that prevent bubble formation in the sealant layer. This preliminary anti-action ensures that air bubbles cannot form channels that would compromise gene sequencing accuracy, while maintaining a relatively simple substrate structure.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the packaging yield and accuracy of gene sequencing by eliminating air bubbles and ensuring uniform sealant distribution, leading to improved flatness and reduced production costs.

Implementation Method 1

the accommodation region is set as a first groove, and the first groove surrounds the test region

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS11583856B2Bio-information detection substrate and gene chip
Publication Date: 2023.02.21 BEIJING BOE OPTOELECTRONCIS TECH CO LTD
  • US11583856B2 patent drawing
  • US11583856B2 patent drawing
  • US11583856B2 patent drawing

AI summary

A bio-information detection substrate and a gene chip are provided. The substrate includes a first main surface, the first main surface includes a test region and a dummy region located around the test region, at least one accommodation region is disposed on the first main surface, and the accommodation region is located in the dummy region.