Gene Sequencing Structure Using Thin-Film Transistor Array
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Solution Overview
Problem
Existing gene sequencing technologies require complex laser light sources and optical systems, as well as expensive fluorescent labeling reagents, leading to high sequencing costs and complexity.
Innovation Solution
A gene sequencing structure comprising a substrate with a thin-film transistor array layer, an ion-sensitive layer, a micro-hole layer, a conductive structure, and a detection chip, which allows for gene sequencing without the need for fluorescent labels or laser light sources, using a thin-film transistor array to detect current changes indicative of base pairing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If fluorescence detection scheme is used for gene sequencing, then detection capability is achieved, but device complexity increases due to complicated laser light source and optical system
Solution Approach 1:
The patent replaces the optical detection system (laser light source, optical components, fluorescence detection) with an electrical detection system based on thin-film transistors. The TFT structure directly detects ionic current changes caused by nucleic acid base pairing, eliminating the need for complex optical components while achieving equivalent or superior detection sensitivity and precision.
2Measurement precision
If fluorescent labeling reagents are used for gene sequencing, then sequence detection is enabled, but sequencing cost increases due to expensive reagents
Solution Approach 1:
The patent employs disposable micro-hole structures that can be fabricated in large arrays on a single substrate at low cost using standard semiconductor manufacturing techniques. Each micro-hole serves as a single-use reaction chamber, replacing expensive fluorescent reagents with inexpensive, reusable substrate structures that enable high-throughput parallel sequencing.
3Productivity
If traditional gene sequencing methods are used, then sequencing can be performed, but process complexity increases due to multiple components and steps
Solution Approach 1:
The patent integrates multiple functional components into a single unified structure: the substrate provides mechanical support and electrical connections, the thin-film transistor array performs both signal amplification and detection, and the micro-hole layer serves as both reaction chambers and fluidic channels. This consolidation reduces the number of separate components and simplifies the overall system architecture while maintaining high sequencing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the gene sequencing process, reduces costs by eliminating the need for expensive reagents and complex optical systems, and improves efficiency through the use of a detection chip to monitor current changes between electrodes.
Implementation Method 1
an ion-sensitive layer located on a side of the semiconductor layer away from the substrate
Implementation Method 2
the semiconductor layer at least partially overlaps the first electrode and the second electrode, respectively
Data Source
AI summary
A gene sequencing structure, a gene sequencing device and a gene sequencing method are provided. The gene sequencing structure includes a substrate, a thin-film transistor array layer located on the substrate and including thin-film transistors that include a first electrode, and a second electrode; an ion-sensitive layer located on a side of the semiconductor layer away from the substrate; a micro-hole layer located on a side of the ion-sensitive layer away from the substrate, including a through-hole passing through the micro-hole layer, at least partially overlapping the semiconductor layer, and used for receiving a to-be-tested single-stranded nucleic acid inside; a conductive structure, located on a side of the layer away from the substrate and electrically connected to the first electrode or the second electrode; and a detection chip, located on a side of the conductive structure away from the substrate and electrically connected to the conductive structure.